Reliability Monitoring in Drilling Electronic Circuit Boards

[+] Author and Article Information
H. Hocheng, C. L. Jiaa

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan R.O.C.

J. Electron. Packag 113(3), 263-267 (Sep 01, 1991) (5 pages) doi:10.1115/1.2905405 History: Received September 05, 1990; Revised May 09, 1991; Online April 28, 2008


The purpose of the current study is to provide a monitoring scheme for evaluating the reliability of drilling of electronic circuit board (ECB) made of FR4 composite materials. The ECB is a laminated mechanical structure. Delamination often occurs at the hole exit during drilling. The resulted delamination deteriorates the long-term performance of the ECB when subject to mechanical and/or thermal loading. Acoustic emission can monitor the extent of this damage. A linear relationship exists between the size of delamination and the energy level of emitted signal when the proposed signal processing technique is used. The results contribute to higher quality ECB’s and can be applied in the manufacturing stage in an automated manner.

Copyright © 1991 by The American Society of Mechanical Engineers
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