Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

[+] Author and Article Information
J. G. Stack, M. S. Acarlar

AT&T Bell Laboratories, Solid State Technology Center, Breinigsville, PA 18031-9359

J. Electron. Packag 113(3), 258-262 (Sep 01, 1991) (5 pages) doi:10.1115/1.2905404 History: Received December 05, 1989; Revised June 20, 1991; Online April 28, 2008


The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes

Copyright © 1991 by The American Society of Mechanical Engineers
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