Fatigue Analysis of a Planarpak™ Surface Mount Component

[+] Author and Article Information
I. Sharif, D. B. Barker, A. Dasgupta, M. G. Pecht

CALCE Center for Electronics Packaging, University of Maryland, College Park, MD 20742

J. Electron. Packag 113(2), 194-199 (Jun 01, 1991) (6 pages) doi:10.1115/1.2905387 History: Received August 01, 1990; Revised February 01, 1991; Online April 28, 2008


This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed wiring board. The critical thermal stresses and strains are analyzed with the help of two and three-dimensional finite element models. The effect of solder voids and incomplete bonding is also investigated. The paper also shows how fatigue life estimations can be made using q generalized form of the Manson-Coffin equation even though the maximum solder attach stresses are found to be elastic.

Copyright © 1991 by The American Society of Mechanical Engineers
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