Effect of Polarity on Heat Transfer in the Ball Formation Process

[+] Author and Article Information
L. J. Huang

Harrison Radiator Division, GMC, Lockport, NY 14094

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104-6315

J. Electron. Packag 113(1), 33-39 (Mar 01, 1991) (7 pages) doi:10.1115/1.2905364 History: Received June 18, 1990; Revised January 04, 1991; Online April 28, 2008


Ball formation is the first step in wire bonding of semiconductor chips to their lead frames. An electric discharge melts the wire and surface tension causes the melt to roll up into a ball; the ball is subsequently pressed onto the proper bond pad on the chip to make a ball bond. In the ball bonding process, the electrical discharge characteristics, the associated heat transport, and the wire material determine the nature of the ball formed. The discharge shows sensitivity to the polarity of the wire. Experiments with upscaled aluminum and copper wires in air at reduced pressure show that the heat transfer to the wire associated with the discharge is significantly greater when the wire is the anode than when the wire is the cathode. These experiments included temperature measurements in real time made by fine thermocouples implanted in upscaled wires. In aluminum the anode wire receives twice as much energy from the arc as the cathode wire. In copper the anode wire receives three times as much energy from the arc as the cathode. Our conclusions are also reinforced by metallographic examination of sectioned balls.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In