Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case

[+] Author and Article Information
G. L. Lehmann, J. Pembroke

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, N.Y. 13901

J. Electron. Packag 113(1), 21-26 (Mar 01, 1991) (6 pages) doi:10.1115/1.2905361 History: Received November 21, 1989; Revised October 12, 1990; Online April 28, 2008


Forced convection cooling of a simulated array of card-mounted electronic components has been investigated. An important feature of the simulated components is their relatively low profile (height/length = 0.058). Laboratory measurements of heat transfer rates resulting from convective air flow through a low aspect ratio channel are reported. The effect of variations in array position, channel spacing and flow rate is discussed. In the flow range considered laminar, transitional and turbulent heat transfer behavior have been observed. The behavior due to variations in flow rate and channel spacing is well correlated using a Reynolds number based on component length.

Copyright © 1991 by The American Society of Mechanical Engineers
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