Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding

[+] Author and Article Information
E. Suhir, L. T. Manzione

AT&T Bell Laboratories, Murray Hill, NJ 07974

J. Electron. Packag 113(1), 16-20 (Mar 01, 1991) (5 pages) doi:10.1115/1.2905359 History: Received August 27, 1990; Revised January 16, 1991; Online April 28, 2008


An analytical stress model is developed for the evaluation of flow induced stresses in wire bonds of plastic packages during molding. We limit our analysis to the stresses acting in the plane of a wire bond. These stresses can possibly result in liftoff of the ball bond from the bonding pad of the integrated circuit. The main purpose of the analysis is to evaluate the effect of the wire bond configuration. It is shown that the stresses in wire bonds are proportional to the square of the ratio of the wire-bond span to the diameter of the wire. This explains the difficulty in molding assemblies with long wire bond spans. We also showed that wire configurations, characterized by nonzero slope angles at the ends, result in lower stresses than conventional wire shapes, where the wedge bond to the electric lead forms a zero angle. The obtained results are useful when designing plastic package assemblies and/or choosing the appropriate wire bond loop height and span.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In