Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

[+] Author and Article Information
D. Agonafer, D. F. Moffatt

International Business Machines Corporation, Poughkeepsie, NY 12602

J. Electron. Packag 112(4), 333-337 (Dec 01, 1990) (5 pages) doi:10.1115/1.2904386 History: Received September 01, 1989; Revised October 14, 1990; Online April 28, 2008


Numerical simulation of the fluid and heat transfer characteristics of electronic modules mounted on circuit boards is performed using a commercial finite-control-volume code, PHOENICS. The model is used to simulate the experimental data for flow over blocks simulating electronic modules from published sources of data. The Reynolds numbers considered in both studies vary from 1000 to 7000. The numerically computed heat transfer coefficient agreed with the experimental data in the fully developed region within 8 percent. However, the results were quite sensitive to the transverse grid distribution for flow rates in the turbulent regime. Guidelines are suggested in the effective use of the commercial code for such classes of problems.

Copyright © 1990 by The American Society of Mechanical Engineers
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