Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

[+] Author and Article Information
F. Erdogan, P. F. Joseph

Lehigh University, Bethlehem, PA 18015

J. Electron. Packag 112(4), 309-316 (Dec 01, 1990) (8 pages) doi:10.1115/1.2904383 History: Received August 30, 1989; Revised August 02, 1990; Online April 28, 2008


In this paper the basic residual stress problem for multilayered or multiple films on an elastic substrate is considered. The stresses may be caused by a homogeneous temperature variation or slow thermal cycling and by far field mechanical loading. The films are approximated by orthotropic membranes and the substrate is assumed to be an elastic continuum. The interfacial zone is modeled by either an ideal interface or a homogeneous shear layer. The primary interest in the paper is in examining stress concentrations or singularities near the film ends. For the two interface conditions considered, this is done by varying the film/substrate contact angle. Also studied are strain energy release rate for the propagation of an interfacial crack and the direction and the magnitude of the maximum cleavage stress for a possible crack initiation in the substrate. The basic modeling and analysis are considered in Part I. Part II of the paper is devoted to the presentation and discussion of the results.

Copyright © 1990 by The American Society of Mechanical Engineers
Topics: Modeling
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In