Fracture of Glass Seals in Surface Mount IC Packages

[+] Author and Article Information
Karl K. Stevens, Tin-Lup Wong, Ajit Renavikar

Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

Wayne Chen

Northern Telecom Electronics, Inc., West Palm Beach, Fl 33407

J. Electron. Packag 112(2), 162-167 (Jun 01, 1990) (6 pages) doi:10.1115/1.2904357 History: Received April 10, 1990; Online April 28, 2008


Results of a study to investigate the cracking of glass seals in a surface-mount integrated circuit package with ceramic covers are presented. Finite element analyses were combined with principles of fracture mechanics to estimate values of lead tip displacement (or applied force) at the onset of seal cracking. Such cracking provides points of entry for moisture, and otherwise degrades package reliability. Limiting values of lead tip displacement were estimated by three different approaches. The results obtained were in close agreement, and appear to be consistent with physical observations.

Copyright © 1990 by The American Society of Mechanical Engineers
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