Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue

[+] Author and Article Information
J. R. Wilcox, R. Subrahmanyan, Che-Yu Li

Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853

J. Electron. Packag 112(2), 115-122 (Jun 01, 1990) (8 pages) doi:10.1115/1.2904351 History: Received April 06, 1990; Online April 28, 2008


The ramifications of the definition of failure on solder joint fatigue life are discussed in terms of two considerations: (1) the dependence of the measured damage parameter (load drop or resistance increase) on the solder joint area and (2) the time profile of solder joint area. The latter is influenced by the applied displacement profile, the assembly stiffness, the deformation properties of the solder joint, and the dependence of rate of fatigue damage accumulation on its driving force. Experimental data are presented to illustrate the influence of these considerations on failure criterion. An integral methodology is used for the description of damage accumulation. Representative simulations are performed that demonstrate failure criterion effects on apparent fatigue life. Isothermal mechanical displacement controlled cyclic loading is emphasized. The principles presented may also be applied to thermal cycling of solder interconnects.

Copyright © 1990 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In