Isothermal Fatigue Behavior of Sn-Pb Solder Joints

[+] Author and Article Information
T. S. E. Summers, J. W. Morris

Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California at Berkeley, Berkeley, CA 94720

J. Electron. Packag 112(2), 94-99 (Jun 01, 1990) (6 pages) doi:10.1115/1.2904364 History: Received April 10, 1990; Online April 28, 2008


Isothermal fatigue data were collected for the compositions 5Sn-95Pb, 20Sn-80Pb, 40Sn-60Pb, 50Sn-50Pb and 63Sn-37Pb within the binary Sn-Pb system. All of these compositions are commercially available and include those most commonly used. Because Sn-rich solders are rarely used, they were not investigated here. The fatigue life was defined by a 30 percent load drop. The solders were tested in a double shear configuration joined to copper at 75° C. The displacement rate chosen was 0.01 mm/min, which corresponds to a strain rate of 1.5 × 10−4 s−1 for our specimen configuration, over a 10 percent plastic strain range. Additionally, the microstructural changes during fatigue are presented. The various solder compositions studied exhibit strikingly different as-solidified microstructures. These differences are discussed in terms of their effect on the isothermal joint failure mechanism and joint isothermal fatigue life.

Copyright © 1990 by The American Society of Mechanical Engineers
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