Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling

[+] Author and Article Information
X. S. Wang, Z. Dagan, L. M. Jiji

Department of Mechanical Engineering, The City College of the City University of New York, New York, NY 10031

J. Electron. Packag 112(1), 57-62 (Mar 01, 1990) (6 pages) doi:10.1115/1.2904342 History: Received April 20, 1989; Online April 28, 2008


In this paper, a previously developed analytic solution is applied to the conjugate heat transfer problem of jet impingement cooling of a microelectronic chip. The analysis is used to predict the surface temperature and heat flux distributions of a chip cooled by a laminar impinging FC-77 liquid or water jet with uniform heat flux dissipation at the heated bottom of the chip. Results are presented for two jet diameters of 0.5 and 1 mm. It is shown that, for a constant Reynolds number, the surface temperature is lower when the jet diameter is smaller. On the other hand, when the jet diameter is increased, the surface temperature and heat flux distributions are more uniform. Water jet impingement cooling shows much lower surface temperature and much higher heat transfer coefficient than FC-77 jet cooling. The thermal resistance for FC-77 liquid jet is 6 times larger than that for a water jet.

Copyright © 1990 by The American Society of Mechanical Engineers
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