Performance of a Conduction Cooling Module

[+] Author and Article Information
Tae-Ho Song, Se Yoon Bang

Korea Institute of Machinery & Metals, Changwon, Kyungnam, Korea

J. Electron. Packag 112(1), 52-56 (Mar 01, 1990) (5 pages) doi:10.1115/1.2904341 History: Received May 15, 1989; Revised October 11, 1989; Online April 28, 2008


A piston-type conduction cooling module for PCB-mounted IC’s has been developed and tested. Analysis of performance has been made using a finite difference scheme for the conduction piston. The effect of direct contact area between the piston and the IC as well as the effect of thermal conduction grease between them have been investigated. An analytical solution for the heat transfer coefficient of coolant flowing along the side of piston has been obtained. Excellent agreement between experimental and analytical results has been found. The overall thermal resistance from the IC to the coolant can be lowered to 3° C/W or less with negligible coolant-side pressure drop for practical applications.

Copyright © 1990 by The American Society of Mechanical Engineers
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