A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods

[+] Author and Article Information
J. H. Lau

Hewlett-Packard Co., Palo Alto, CA 94304

J. Electron. Packag 111(4), 313-320 (Dec 01, 1989) (8 pages) doi:10.1115/1.3226554 History: Received August 20, 1989; Online November 09, 2009


The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to obtain the correct thermal stresses is recommended.

Copyright © 1989 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In