Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

J. Electron. Packag 111(4), 310-312 (Dec 01, 1989) (3 pages) doi:10.1115/1.3226553 History: Received August 23, 1989; Online November 09, 2009


We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.

Copyright © 1989 by ASME
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