A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

[+] Author and Article Information
T. Hattori, S. Sakata

Mechanical Engineering Research Laboratory, Hitachi Ltd., Ibaraki, Japan

G. Murakami

Semiconductor Design & Development Center, Hitachi Ltd., Tokyo, Japan

J. Electron. Packag 111(4), 243-248 (Dec 01, 1989) (6 pages) doi:10.1115/1.3226542 History: Received March 28, 1989; Revised August 17, 1989; Online November 09, 2009


Since the stress and displacement fields near a bonding edge show singularity behaviors, the adhesive strength evaluation method, using maximum stresses calculated by a numerical stress analysis such as the finite element method, is generally not valid. In this paper, a new method, which uses two stress singularity parameters, is presented for evaluating adhesive strength. This method is applied to several kinds of molded models, composed of epoxy base resin and Fe-Ni alloy sheets, and plastic encapsulated LSI models. Predictions about the initiation and extension of delamination are compared with the results of observations made by scanning acoustic tomography on these models.

Copyright © 1989 by ASME
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