Twist-Off Testing of Solder Joint Interconnections

[+] Author and Article Information
E. Suhir

AT&T Bell Laboratories, Murray Hill, New Jersey 07974

J. Electron. Packag 111(3), 165-171 (Sep 01, 1989) (7 pages) doi:10.1115/1.3226529 History: Received December 13, 1988; Revised May 09, 1989; Online November 09, 2009


Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we briefly discuss the merits and shortcomings of both techniques and determine the relationship between the ultimate torque and the ultimate shearing force. We also suggest a simple experimental method for the evaluation of the shearing strength of solder joints on the basis of twist-off testing. It should be emphasized that such testing can be used not only for a tentative comparative evaluation of different interconnections but as a quality control vehicle as well.

Copyright © 1989 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In