Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

[+] Author and Article Information
M. D. Osterman

Systems Research Center, University of Maryland, College Park, MD 20742

M. Pecht

Mechanical Engineering Department, University of Maryland, College Park, MD 20742

J. Electron. Packag 111(2), 149-156 (Jun 01, 1989) (8 pages) doi:10.1115/1.3226521 History: Received August 01, 1987; Revised March 22, 1989; Online November 09, 2009


With the increased demand for highly reliable electronic equipment and limitations that make improvements to the reliability of individual components difficult to obtain, methods to improve the reliability at higher levels of packaging are being sought. This article presents the mathematical theory for improving reliability by appropriately locating components on conductively cooled printed wiring boards based on the thermal behavior of the components on the board. Placement techniques are then constructed to minimize the total failure rate of the collection of components.

Copyright © 1989 by ASME
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