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Journal Articles

Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing

Jonathan D. Weiss
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 2007, 74(5): 996–1005.
https://doi.org/10.1115/1.2723813
Published Online: January 31, 2007
.... N. , and Howell , L. L. , 2002 , “ Modeling the Thermal Behavior of a Surface-Micromachine Linear-Displacement Thermomechanical Microactuator ,” Sens. Actuators, A 0924-4247 10.1016/S0924-4247(02)00202-9 , 101 , pp. 239 – 250 . Anderson , T. L. , 1995 , Fracture Mechanics...
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Topics: Actuators, Buckling, Eddies (Fluid dynamics), Magnetic fields, Microelectromechanical systems, Polysilicon, Stress, Testing, Thermal expansion, Failure