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Journal Articles

Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing

Jonathan D. Weiss
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 2007, 74(5): 996–1005.
https://doi.org/10.1115/1.2723813
Published Online: January 31, 2007
...Jonathan D. Weiss Like microelectronic circuits, microelectromechanical systems (MEMS) devices are susceptible to damage by electrostatic discharge (ESD). At Sandia National Laboratories, polysilicon electrothermal MEMS actuators have been subjected to ESD pulses to examine that susceptibility...
View Article titled, Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under <span class="search-highlight">Electrostatic</span> <span class="search-highlight">Discharge</span> Testing
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Topics: Actuators, Buckling, Eddies (Fluid dynamics), Magnetic fields, Microelectromechanical systems, Polysilicon, Stress, Testing, Thermal expansion, Failure