Page 1 | Search Results | J. Appl. Mech.

1-19 of 19

Sort by

Sort Order Select

Journal Articles

Dependence of Critical Stress Intensity Factor on Crack Depth From the Loading Boundary of Crystalline Silicon

Ayan Basu, Gaurav Singh

Publisher: ASME

J. Appl. Mech. June 2024, 91(6): 061001.

Paper No: JAM-23-1415

https://doi.org/10.1115/1.4064545

Published Online: February 21, 2024

View Article titled, Dependence of Critical Stress Intensity Factor on Crack Depth From the Loading Boundary of Crystalline Silicon

Topics: Fracture (Materials), Silicon, Stress, Crack propagation, Critical points (Physics)

Journal Articles

Computational Modeling of Electrochemomechanics of High-Capacity Composite Electrodes in Li-Ion Batteries

Sameep Rajubhai Shah, Luize Scalco de Vasconcelos, Kejie Zhao

Publisher: ASME

J. Appl. Mech. August 2022, 89(8): 081005.

Paper No: JAM-22-1132

https://doi.org/10.1115/1.4054759

Published Online: June 27, 2022

View Article titled, Computational Modeling of Electrochemomechanics of High-Capacity Composite Electrodes in Li-Ion Batteries

Topics: Charge transfer, Composite materials, Deformation, Diffusion (Physics), Electrodes, Lithium-ion batteries, Silicon, Stress, Computer simulation, Cycles

Includes: Supplementary data

Journal Articles

Thermal and Mechanical Analyses of Compliant Thermoelectric Coils for Flexible and Bio-Integrated Devices

Kan Li, Lin Chen, Feng Zhu, Yonggang Huang

Publisher: ASME

J. Appl. Mech. February 2021, 88(2): 021011.

Paper No: JAM-20-1557

https://doi.org/10.1115/1.4049070

Published Online: November 20, 2020

View Article titled, Thermal and Mechanical Analyses of Compliant Thermoelectric Coils for Flexible and Bio-Integrated Devices

Topics: Buckling, Composite materials, Design, Geometry, Heat, Heat transfer, Temperature, Thermal analysis, Thermoelectric devices, Thin films

Journal Articles

Determining a Lower Bound Mixed Mode Failure Curve for An Interface Crack Between Single Crystal Silicon and Silicone Rubber

Subramanyam Reddy Matli, Ella Rubin, Leslie Banks-Sills

Publisher: ASME

J. Appl. Mech. February 2021, 88(2): 021006.

Paper No: JAM-20-1455

https://doi.org/10.1115/1.4048805

Published Online: November 4, 2020

View Article titled, Determining a Lower Bound Mixed Mode Failure Curve for An Interface Crack Between Single Crystal Silicon and Silicone Rubber

Topics: Displacement, Failure, Fracture (Materials), Silicone rubber, Stress, Silicon, Crystals, Disks

Includes: Supplementary data

Journal Articles

B-Splines and NURBS Based Finite Element Methods for Strained Electronic Structure Calculations

Arif Masud, Ahmad A. Al-Naseem, Raguraman Kannan, Harishanker Gajendran

Publisher: ASME

J. Appl. Mech. September 2018, 85(9): 091009.

Paper No: JAM-18-1167

https://doi.org/10.1115/1.4040454

Published Online: June 18, 2018

View Article titled, B-Splines and NURBS Based Finite Element Methods for Strained Electronic Structure Calculations

Topics: Atoms, B-splines, Density, Electron configuration, Electrons, Finite element methods, Germanium, Polishing equipment, Schrödinger equation, Silicon

Journal Articles

Analytical Model on Lithiation-Induced Interfacial Debonding of an Active Layer From a Rigid Substrate

Bo Lu, Yanfei Zhao, Yicheng Song, Junqian Zhang

Publisher: ASME

J. Appl. Mech. December 2016, 83(12): 121009.

Paper No: JAM-16-1329

https://doi.org/10.1115/1.4034783

Published Online: October 5, 2016

View Article titled, Analytical Model on Lithiation-Induced Interfacial Debonding of an Active Layer From a Rigid Substrate

Topics: Boundary-value problems, Damage, Displacement, Electrodes, Thin films, Silicon, Differential equations, Aluminum, Copper, Fracture (Materials)

Journal Articles

Mixed-Mode Interactions Between Graphene and Substrates by Blister Tests

Zhiyi Cao, Li Tao, Deji Akinwande, Rui Huang, Kenneth M. Liechti

Publisher: ASME

J. Appl. Mech. August 2015, 82(8): 081008.

Paper No: JAM-15-1176

https://doi.org/10.1115/1.4030591

Published Online: August 1, 2015

View Article titled, Mixed-Mode Interactions Between Graphene and Substrates by Blister Tests

Topics: Copper, Fracture (Materials), Graphene, Photoresists, Plasma desorption mass spectrometry, Silicon, Deflection, Adhesion, Delamination, Fracture (Process)

Journal Articles

Peeling Silicene From Model Silver Substrates in Molecular Dynamics Simulations

Zhao Qin, Zhiping Xu, Markus J. Buehler

Publisher: ASME

J. Appl. Mech. October 2015, 82(10): 101003.

Paper No: JAM-15-1213

https://doi.org/10.1115/1.4030888

Published Online: July 10, 2015

View Article titled, Peeling Silicene From Model Silver Substrates in Molecular Dynamics Simulations

Topics: Molecular dynamics simulation, Silver, Graphene, Computational mechanics, Elasticity, Engineering simulation, Flow (Dynamics), Fracture (Materials), Fracture (Process), Honeycomb structures

Journal Articles

Quantitative Infrared Photoelasticity of Silicon Photovoltaic Wafers Using a Discrete Dislocation Model

T.-W. Lin, G. P. Horn, H. T. Johnson

Publisher: ASME

J. Appl. Mech. January 2015, 82(1): 011001.

Paper No: JAM-14-1337

https://doi.org/10.1115/1.4028987

Published Online: January 1, 2015

View Article titled, Quantitative Infrared Photoelasticity of Silicon Photovoltaic Wafers Using a Discrete Dislocation Model

Topics: Dislocations, Semiconductor wafers, Silicon, Stress

Journal Articles

Investigation of Thermal Stress Variability Due to Microstructure in Thin Aluminum Films

Antoinette M. Maniatty, G. S. Cargill, III, Laura E. Moyer, Chia-Ju Yang

Publisher: ASME

J. Appl. Mech. January 2011, 78(1): 011012.

https://doi.org/10.1115/1.4002212

Published Online: October 20, 2010

View Article titled, Investigation of Thermal Stress Variability Due to Microstructure in Thin Aluminum Films

Topics: Aluminum, Cycles, Dislocations, Finite element model, Grain size, Temperature, Thermal stresses, Crystals, Simulation, Constitutive equations

Journal Articles

Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing

Jonathan D. Weiss

Publisher: ASME

J. Appl. Mech. September 2007, 74(5): 996–1005.

https://doi.org/10.1115/1.2723813

Published Online: January 31, 2007

View Article titled, Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing

Topics: Actuators, Buckling, Eddies (Fluid dynamics), Magnetic fields, Microelectromechanical systems, Polysilicon, Stress, Testing, Thermal expansion, Failure

Journal Articles

Measurement of Biaxial Stress States in Silicon Using Micro-Raman Spectroscopy

Peter A. Gustafson, Stephen J. Harris, Ann E. O’Neill, Anthony M. Waas

Publisher: ASME

J. Appl. Mech. September 2006, 73(5): 745–751.

https://doi.org/10.1115/1.2187527

Published Online: January 18, 2006

View Article titled, Measurement of Biaxial Stress States in Silicon Using Micro-Raman Spectroscopy

Topics: Silicon, Stress

Journal Articles

A Hybrid Continuum-Molecular Analysis of Interfacial Force Microscope Experiments on a Self-Assembled Monolayer

Mingji Wang, Kenneth M. Liechti, Vibha Srinivasan, John M. White, Peter J. Rossky, Matthew T. Stone

Publisher: ASME

J. Appl. Mech. September 2006, 73(5): 769–777.

https://doi.org/10.1115/1.1943435

Published Online: November 24, 2004

View Article titled, A Hybrid Continuum-Molecular Analysis of Interfacial Force Microscope Experiments on a Self-Assembled Monolayer

Topics: Adhesives, Finite element analysis, Microscopes, Molecular dynamics simulation, Nanoindentation, Self-assembly, Simulation, Silicon, Elastic analysis

Journal Articles

Strain-Modulated Adatom and Surface Vacancy Pair Interactions

P. Liu, R. V. Kukta, D. Kouris

Publisher: ASME

J. Appl. Mech. May 2005, 72(3): 400–407.

https://doi.org/10.1115/1.1875392

Published Online: October 6, 2004

View Article titled, Strain-Modulated Adatom and Surface Vacancy Pair Interactions

Topics: Atoms, Dipoles (Electromagnetism), Elasticity, Nanostructures , Physics, Separation (Technology), Stress, Constitutive equations, Crystals, Elemental semiconductors

Journal Articles

Thermal Deformation of Initially Curved Substrates Coated by Thin Inhomogeneous Layers

A. Wikstro¨m, P. Gudmundson, Mem. ASME

Publisher: ASME

J. Appl. Mech. March 2001, 68(2): 298–303.

https://doi.org/10.1115/1.1357169

Published Online: October 19, 2000

View Article titled, Thermal Deformation of Initially Curved Substrates Coated by Thin Inhomogeneous Layers

Topics: Anisotropy, Coatings, Deformation, Membranes, Shells, Stress, Boundary layers, Deflection, Silicon, Thermal deformation

Journal Articles

The Matrix-Fiber Crack in an Elastic Solid

A. P. S. Selvadurai, B. M. Singh, M. C. Au

Publisher: ASME

J. Appl. Mech. September 1996, 63(3): 639–649.

https://doi.org/10.1115/1.2823344

Published Online: September 1, 1996

View Article titled, The Matrix-Fiber Crack in an Elastic Solid

Topics: Fibers, Fracture (Materials), Fracture (Process), Stress, Adhesion, Boundary-value problems, Ceramics, Elasticity, Epoxy adhesives, Epoxy resins

Journal Articles

An Energy Approach to the Plasticity of a Two-Phase Composite Containing Aligned Inclusions

Y. P. Qiu, G. J. Weng

Publisher: ASME

J. Appl. Mech. December 1995, 62(4): 1039–1046.

https://doi.org/10.1115/1.2896040

Published Online: December 1, 1995

View Article titled, An Energy Approach to the Plasticity of a Two-Phase Composite Containing Aligned Inclusions

Topics: Composite materials, Plasticity, Stress, Aluminum, Elasticity, Fiber reinforced composites, Nonlinear systems, Plane strain, Shapes, Shear modulus

Journal Articles

Viscoplastic Buckling of Silicon Ribbon

C. T. Tsai, O. W. Dillon, Jr.

Publisher: ASME

J. Appl. Mech. September 1987, 54(3): 563–570.

https://doi.org/10.1115/1.3173070

Published Online: September 1, 1987

View Article titled, Viscoplastic Buckling of Silicon Ribbon

Topics: Buckling, Silicon, Deflection, Creep, Residual stresses, Stress

Journal Articles

Yield Strength and Microstructural Scale: A Continuum Study of Pearlitic Versus Spheroidized Steel

T. W. Butler, D. C. Drucker

Publisher: ASME

J. Appl. Mech. September 1973, 40(3): 780–784.

https://doi.org/10.1115/1.3423089

Published Online: September 1, 1973

View Article titled, Yield Strength and Microstructural Scale: A Continuum Study of Pearlitic Versus Spheroidized Steel

Topics: Steel, Yield strength, Flow (Dynamics), Optical microscopes, Particulate matter, Structural metals, Aluminum, Atoms, Continuum mechanics, Crystals

Journal citation

NARROW

Supplemental Material

Dependence of Critical Stress Intensity Factor on Crack Depth From the Loading Boundary of Crystalline Silicon

Computational Modeling of Electrochemomechanics of High-Capacity Composite Electrodes in Li-Ion Batteries

Thermal and Mechanical Analyses of Compliant Thermoelectric Coils for Flexible and Bio-Integrated Devices

Determining a Lower Bound Mixed Mode Failure Curve for An Interface Crack Between Single Crystal Silicon and Silicone Rubber

B-Splines and NURBS Based Finite Element Methods for Strained Electronic Structure Calculations

Analytical Model on Lithiation-Induced Interfacial Debonding of an Active Layer From a Rigid Substrate

Mixed-Mode Interactions Between Graphene and Substrates by Blister Tests

Peeling Silicene From Model Silver Substrates in Molecular Dynamics Simulations

Quantitative Infrared Photoelasticity of Silicon Photovoltaic Wafers Using a Discrete Dislocation Model

Investigation of Thermal Stress Variability Due to Microstructure in Thin Aluminum Films

Magnetic Force and Thermal Expansion as Failure Mechanisms of Electrothermal MEMS Actuators Under Electrostatic Discharge Testing

Measurement of Biaxial Stress States in Silicon Using Micro-Raman Spectroscopy

A Hybrid Continuum-Molecular Analysis of Interfacial Force Microscope Experiments on a Self-Assembled Monolayer

Strain-Modulated Adatom and Surface Vacancy Pair Interactions

Thermal Deformation of Initially Curved Substrates Coated by Thin Inhomogeneous Layers

The Matrix-Fiber Crack in an Elastic Solid

An Energy Approach to the Plasticity of a Two-Phase Composite Containing Aligned Inclusions

Viscoplastic Buckling of Silicon Ribbon

Yield Strength and Microstructural Scale: A Continuum Study of Pearlitic Versus Spheroidized Steel

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only