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Journal Articles

Conformal Theoretical Modeling of Arbitrary Shape Flexible Electronic Sensors Mounted Onto General Curved Surface Substrates

Shihang Wang, Jie Jin, Deqing Mei, Yancheng Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2023, 90(11): 111007.
Paper No: JAM-23-1178
https://doi.org/10.1115/1.4062905
Published Online: August 3, 2023
View Article titled, Conformal Theoretical Modeling of Arbitrary Shape Flexible Electronic Sensors Mounted Onto General Curved Surface Substrates
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Topics: Flexible electronics, Modeling, Sensors, Shapes, Displacement, Design
Journal Articles

Theoretical Modeling of Conformal Criterion for Flexible Electronics Attached Onto Complex Surface

Lin Xiao, Ming Cheng, Furong Chen, Shan Jiang, YongAn Huang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 2022, 89(3): 031005.
Paper No: JAM-21-1414
https://doi.org/10.1115/1.4052966
Published Online: December 7, 2021
View Article titled, Theoretical Modeling of Conformal Criterion for Flexible Electronics Attached Onto Complex Surface
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Topics: Design, Displacement, Electronics, Finite element analysis, Flexible electronics, Pressure, Shapes, Modeling, Geometry, Theoretical analysis
Journal Articles

Properties of Porous PDMS and Stretchability of Flexible Electronics in Moist Environment

Peng Pan, Zuguang Bian, Xin Song, Xiaoliang Zhou
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. October 2020, 87(10): 101009.
Paper No: JAM-20-1318
https://doi.org/10.1115/1.4047775
Published Online: July 27, 2020
View Article titled, Properties of Porous PDMS and Stretchability of Flexible Electronics in Moist Environment
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Topics: Flexible electronics, Plasma desorption mass spectrometry, Elastic moduli, Porosity
Journal Articles

A Traction-Free Model for the Tensile Stiffness and Bending Stiffness of Laminated Ribbons of Flexible Electronics

Shizhen Yin, Yewang Su
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. May 2019, 86(5): 051011.
Paper No: JAM-19-1043
https://doi.org/10.1115/1.4042920
Published Online: March 16, 2019
View Article titled, A Traction-Free Model for the Tensile Stiffness and Bending Stiffness of Laminated Ribbons of Flexible Electronics
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Topics: Flexible electronics, Plane strain, Stiffness, Stress, Traction, Poisson ratio
Journal Articles

Mechanics of Periodic Film Cracking in Bilayer Structures Under Stretching

Xianhong Meng, Zihao Wang, Sandra Vinnikova, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2018, 85(7): 071006.
Paper No: JAM-18-1115
https://doi.org/10.1115/1.4039757
Published Online: May 8, 2018
View Article titled, Mechanics of Periodic Film Cracking in Bilayer Structures Under Stretching
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Topics: Cracking (Materials), Fracture (Materials), Fracture (Process), Stress, Flexible electronics, Stress concentration, Finite element analysis, Displacement, Biological tissues
Includes: Supplementary data
Journal Articles

Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics

Xianhong Meng, Boya Liu, Yu Wang, Taihua Zhang, Jianliang Xiao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. August 2016, 83(8): 081011.
Paper No: JAM-16-1257
https://doi.org/10.1115/1.4033754
Published Online: June 16, 2016
View Article titled, Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics
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Topics: Displacement, Finite element methods, Finite element model, Flexible electronics, Plasma desorption mass spectrometry, Polynomials, Shear (Mechanics), Shear stress, Polymers, Boundary-value problems
Journal Articles

Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2012, 79(1): 011010.
https://doi.org/10.1115/1.4005191
Published Online: December 13, 2011
View Article titled, Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier
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Topics: Manufacturing, Shear stress, Stress, Flexible electronics, Tension, Cross section (Physics)