An X-ray microbeam study and a polycrystal finite element model of a section of a thick polycrystalline aluminum film on a silicon substrate are used to investigate the effect of microstructure on thermal stress variability. In the X-ray microbeam study, the grain orientations and deviatoric elastic strain field are measured at the subgrain level in the film during and after two thermal cycles. A finite element model of the observed grain structure is created and modeled with an elastoviscoplastic crystal constitutive model that incorporates film thickness and grain size effects as well as dislocation entanglement hardening. The experimental and simulation results are compared at both the film and subgrain scales. While the experiment and model agree fairly well at the film level, the experimental results show much greater elastic strain variability than the simulations. In considering the grain size effect, the experiment and model both predict a similar Hall–Petch coefficient, which is consistent with literature data on free standing aluminum thin films.
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January 2011
Research Papers
Investigation of Thermal Stress Variability Due to Microstructure in Thin Aluminum Films
Antoinette M. Maniatty,
Antoinette M. Maniatty
Professor
Fellow of ASME
Department of Mechanical, Aerospace, and Nuclear Engineering,
e-mail: maniaa@rpi.edu
Rensselaer Polytechnic Institute
, 110 8th Street, Troy, NY 12180
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G. S. Cargill, III,
G. S. Cargill, III
Professor Emeritus
Department of Materials Science and Engineering,
e-mail: gsc3@lehigh.edu
Lehigh University
, 5 East Packer Avenue, Bethlehem, PA 18015
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Laura E. Moyer,
Laura E. Moyer
Department of Materials Science and Engineering,
Lehigh University
, 5 East Packer Avenue, Bethlehem, PA 18015
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Chia-Ju Yang
Chia-Ju Yang
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
, 110 8th Street, Troy, NY 12180
Search for other works by this author on:
Antoinette M. Maniatty
Professor
Fellow of ASME
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
, 110 8th Street, Troy, NY 12180e-mail: maniaa@rpi.edu
G. S. Cargill, III
Professor Emeritus
Department of Materials Science and Engineering,
Lehigh University
, 5 East Packer Avenue, Bethlehem, PA 18015e-mail: gsc3@lehigh.edu
Laura E. Moyer
Department of Materials Science and Engineering,
Lehigh University
, 5 East Packer Avenue, Bethlehem, PA 18015
Chia-Ju Yang
Department of Mechanical, Aerospace, and Nuclear Engineering,
Rensselaer Polytechnic Institute
, 110 8th Street, Troy, NY 12180J. Appl. Mech. Jan 2011, 78(1): 011012 (8 pages)
Published Online: October 20, 2010
Article history
Received:
March 24, 2010
Revised:
July 8, 2010
Posted:
July 23, 2010
Published:
October 20, 2010
Online:
October 20, 2010
Citation
Maniatty, A. M., Cargill, G. S., III, Moyer, L. E., and Yang, C. (October 20, 2010). "Investigation of Thermal Stress Variability Due to Microstructure in Thin Aluminum Films." ASME. J. Appl. Mech. January 2011; 78(1): 011012. https://doi.org/10.1115/1.4002212
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