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  • Proceedings Article August 29, 2017

    Hyoungsoon Lee; Tanmoy Maitra; James Palko; Chi Zhang; Michael Barako; Yoonjin Won; Mehdi Asheghi; Kenneth E. Goodson

    Proc. ASME. 58097; ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006.August 29, 2017
    doi: 10.1115/IPACK2017-74090

  • Proceedings Article July 06, 2015

    Catherine Gorlé; Hyoungsoon Lee; Farzad Houshmand; Mehdi Asheghi; Kenneth Goodson; Pritish R. Parida

    Proc. ASME. 56901; Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022.July 06, 2015
    doi: 10.1115/IPACK2015-48129

  • Proceedings Article July 14, 2013

    Hyoungsoon Lee; Ilchung Park; Christopher Konishi; Issam Mudawar; Rochelle I. May; Jeffrey R. Juergens; James D. Wagner; Nancy R. Hall; Henry K. Nahra; Mohammad M. Hasan; Jeffrey R. Mackey

    Proc. ASME. 55485; Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A001.July 14, 2013
    doi: 10.1115/HT2013-17045

  • Editorial May 09, 2018

    J. Electron. Packag. 2018; 140(2):020201-020201-2.
    doi: 10.1115/1.4039660