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  • Proceedings Article July 16, 2013

    Michael K. Patterson; Randall Martin; J. Barr von Oehsen; Jim Pepin; Yogendra Joshi; Vaibhav K. Arghode; Robin Steinbrecher; Jeff King

    Proc. ASME. 55768; Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A013.July 16, 2013
    IPACK2013-73163
    doi: 10.1115/IPACK2013-73163

    TOPICS: Density, Cooling