Showing 1 – 7 of 7
SORT: Best Match Most Recent
VIEW: Basic | Expanded
  • Proceedings Article July 06, 2015

    Qian Jiang; Subhasis Mukherjee; Bastian Vogt; Abhijit Dasgupta; David Shaddock; Liang Yin

    Proc. ASME. 56895; Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005.July 06, 2015
    IPACK2015-48708
    doi: 10.1115/IPACK2015-48708

  • Proceedings Article July 16, 2013

    Bill Burdick; Jeff Erlbaum; Kaustubh Nagarkar; Brian Yanoff; Liang Yin; Raj Bahadur; Esmaeil Heidari; Donna Sherman; James E. Simpson

    Proc. ASME. 55751; Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007.July 16, 2013
    IPACK2013-73314
    doi: 10.1115/IPACK2013-73314

    TOPICS: Sensors