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  • Proceedings Article July 06, 2015

    Quang Nguyen; M. Kaysar Rahim; Jordan C. Roberts; Jeffrey C. Suhling; Richard C. Jaeger

    Proc. ASME. 56895; Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041.July 06, 2015
    IPACK2015-48627
    doi: 10.1115/IPACK2015-48627

    TOPICS: Stress