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  • Proceedings Article July 16, 2013

    Bill Burdick; Jeff Erlbaum; Kaustubh Nagarkar; Brian Yanoff; Liang Yin; Raj Bahadur; Esmaeil Heidari; Donna Sherman; James E. Simpson

    Proc. ASME. 55751; Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007.July 16, 2013
    IPACK2013-73314
    doi: 10.1115/IPACK2013-73314

    TOPICS: Sensors