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Current Issue:

Journal of Electronic Packaging

Research Paper | September 2012
B. Fiedler, K. Kao, L. Keer and M. Fine
J. Electron. Packag.   doi: 10.1115/1.4006708
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
Photogallery | June 2012
AMR Podcast
April 01, 2014
Applied Mechanics Reviews Interview: Prof. David Barnett, part 1
24 minutes, 21 seconds

Prof. David Barnett of Stanford University is the recipient of the 2012 A.C. Eringen Medal from the Society of Engineering Science in recognition of sustained outstanding achievements in Engineering Science, including significant archival publications on topics related to the anisotropic elastic theory of crystal defects, waves in anisotropic elastic solids, non-destructive evaluation of residual stresses using ultrasonics, thermodynamics of stressed solids, modeling of diffusion in fuel cell membranes, and modeling of capacitance of atomic force microscope tips. This AMR audio interview features his personal reflections on applied mechanics and engineering science research, and the opportunities and rewards of a professional career in academia.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor: Bahgat Sammakia,
State University of New York at Binghamton
View Full Editorial Board
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.

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