Journal of Electronic Packaging

Newest Issue: (December 2015, Volume 137, Issue 4)
research-article | March 2015
Research Paper | September 2009
Fei Qin, Tong An, Na Chen and Jie Bai
   doi: 10.1115/1.3144151
research-article | March 2015
Book Review | June 1994
TECHNICAL PAPERS | December 1995
L. T. Yeh
   doi: 10.1115/1.2792113
Technical Brief | March 2004
Ismail Fidan
   doi: 10.1115/1.1646422
Research Paper | March 1993
AMR Podcast
October 01, 2015
Applied Mechanics Reviews Audio Interview: Prof. Gábor Stépán
43 minutes, 23 seconds

Prof. Gábor Stépán is the 2015 recipient of the ASME Thomas K. Caughey Dynamics Award in recognition of his seminal contributions to the analysis of stability of delay-differential equations with application to machine-tool vibrations, robot dynamics and control, wheel shimmy, and human balancing. This AMR audio interview depicts a research and educational career grounded in a love for applied mathematics and a desire for industrial relevance. It tells of his experiences with mainstreaming the counterintuitive effects of time delay, navigating a developing historical and geopolitical context at the conclusion of the cold war, and inspiring new generations of engineers to integrate practice and theory.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Impact Factor (5 yr):0.842

2014 Journal Citation Reports ® by Thomson Reuters, 2015

Frequency: Quarterly
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1043-7398
eISSN: 1528-9044

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