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Journal of Electronic Packaging

Newest Issue: (September 2014, Volume 136, Issue 3)
research-article | March 2014
Chaoran Yang, Fubin Song and S. W. Ricky Lee
J. Electron. Packag.   doi: 10.1115/1.4025915
Photogallery | June 2012
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
Technology Review | June 2014
Peisheng Liu, Jinlan Wang, Liangyu Tong and Yujuan Tao
J. Electron. Packag.   doi: 10.1115/1.4027397
AMR Podcast
September 15, 2014
Applied Mechanics Reviews Audio Interview: Prof. Karl Johan Åström
56 minutes, 52 seconds

Prof. Karl Johan Åström is a pioneer and statesman in the fields of automatic, adaptive, and computer-aided control engineering and system identification, whose fundamental contributions to scholarly and applied research have been uniformly recognized. This AMR audio interview describes his experiences at the interface between academic research and industrial applications, a story of how fortune rewards the bold, and the risks of sending feedback control signals over large distances across manual phone exchanges.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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