Current Issue:

Journal of Electronic Packaging

Photogallery | June 2012
Research Paper | June 2012
Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay and Satish Kumar
J. Electron. Packag.   doi: 10.1115/1.4006141
research-article | September 2013
Ethan Cruz and Yogendra Joshi
J. Electron. Packag.   doi: 10.1115/1.4024944
Research Paper | June 2011
Chu-Hsuan Sha and Chin C. Lee
J. Electron. Packag.   doi: 10.1115/1.4003990
Research Paper | September 2012
B. Fiedler, M. Fine, K. Kao and L. Keer
J. Electron. Packag.   doi: 10.1115/1.4006708
AMR Podcast
July 09, 2014
Applied Mechanics Reviews Audio Interview: Prof. Joe D. Goddard
1 hours, 03 minutes, 54 seconds

Prof. Joe Goddard of the University of California San Diego is the 2012 recipient of the G.I. Taylor Medal of the Society of Engineering Science, awarded for outstanding research contributions in the mechanics of complex fluids and the thermodynamics and transport properties of physical and biological systems. This AMR audio interview features his personal reflections on an international career at the forefront of applied mechanics research, the science and scientists straddling disciplinary boundaries, and work on his “petit soufflerie”, a wind tunnel for probing boundary-layer hydrogen kinetics in atmospheric reentry problems.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor: Bahgat Sammakia,
State University of New York at Binghamton
View Full Editorial Board
ISSN: 1528-9044
eISSN: 1043-7398
Frequency: Quarterly
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.

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