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Journal of Electronic Packaging

Newest Issue: (June 2015, Volume 137, Issue 2)
Review Article | December 2014
Photogallery | June 2012
research-article | June 2015
research-article | June 2015
Sandesh S. Chougule and S. K. Sahu
J. Electron. Packag.   doi: 10.1115/1.4028994
Photogallery | June 2012
research-article | December 2014
research-article | June 2015
Ahmed S. Yousif and Gary L. Solbrekken
J. Electron. Packag.   doi: 10.1115/1.4028958
AMR Podcast
December 01, 2014
Applied Mechanics Reviews Audio Interview: Prof. Stuart Antman
37 minutes, 16 seconds

Prof. Stuart Antman has made fundamental contributions to the development and application of methods for analysis of motion and instability of elastic and plastic bodies. This AMR audio interview describes a career of navigating the Timoshenko and Truesdell traditions of solid mechanics, the developing interface between mechanics and advanced mathematics both within the U.S. and internationally, and mentoring students to choose a path of self-reliance and opportunity for impact.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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