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Current Issue:

Journal of Electronic Packaging

research-article | March 2014
Chaoran Yang, Fubin Song and S. W. Ricky Lee
J. Electron. Packag.   doi: 10.1115/1.4025915
Photogallery | June 2012
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
research-article | June 2013
AMR Podcast
July 31, 2014
Applied Mechanics Reviews audio interview: Prof. Anthony Bloch
00 hours, 44 minutes, 27 seconds

Prof. Anthony Bloch of the University of Michigan is a leading scholar and contributor to the fields of geometric mechanics and control of mechanical systems with symmetry, including as co-author of an influential graduate textbook on nonholonomic mechanics and control. This AMR audio interview features his personal recollections of a wonderful story of fundamental discovery in dynamics and control, scientific friends and collaborators, the growth of a technical community, and remarkable connections between applications of engineering dynamics and the mathematics of symmetry and constraints.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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