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Current Issue:

Journal of Electronic Packaging

Research Paper | September 2012
B. Fiedler, K. Kao, L. Keer and M. Fine
J. Electron. Packag.   doi: 10.1115/1.4006708
Photogallery | June 2012
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
AMR Podcast
January 31, 2014
Applied Mechanics Reviews Audio Interview: Prof. Avram Bar-Cohen, part 1
27 minutes, 12 seconds

Prof. Avram Bar Cohen of the University of Maryland is a leading expert in thermal packaging of micro and nanosystems, and a forward thinker on technological leadership, forecasting, and management. He is an honorary member and Fellow of the ASME and a recent recipient of the 75th Anniversary Medal of ASME's Heat Transfer Division in recognition of service and contributions far beyond the call of duty. This AMR audio interview features his personal reflections on cutting edge research in thermal management and miniaturization, a career of service to the applied mechanics community, the needs for flexible funding and training mechanisms, and the Brooklyn soccer leagues.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor: Bahgat Sammakia,
State University of New York at Binghamton
View Full Editorial Board
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.

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