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Journal of Electronic Packaging

Newest Issue: (December 2015, Volume 137, Issue 4)
FOREWORD | June 2006
research-article | December 2015
Photogallery | June 2012
Photogallery | June 2012
research-article | December 2015
research-article | June 2015
AMR Podcast
June 30, 2015
Applied Mechanics Reviews Audio Interview: Prof. Julia Greer
52 minutes, 49 seconds

Prof. Julia Greer is a highly accomplished innovator in the area of nanoscale materials science and mechanics whose work has been recognized by the Sia Nemat-Nasser ASME Early Career Award, the Materials, Metals, and Minerals Society Early Career Faculty Award, and the Society of Engineering Science Young Investigator Medal. This AMR audio interview explores her pioneering contributions to the science of architectured hierarchical micro- and nanostructures, her engagement in high-impact outreach and translational research, her growth as a professional pianist, and the difficulty of rapping about nanoscale plasticity while playing a Bach partita.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Impact Factor (5 yr):0.842

2014 Journal Citation Reports ® by Thomson Reuters, 2015

Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1043-7398
eISSN: 1528-9044
CODEN: JEPAE4

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