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Journal of Electronic Packaging

Newest Issue: (June 2015, Volume 137, Issue 2)
Photogallery | June 2012
research-article | June 2015
Sandesh S. Chougule and S. K. Sahu
J. Electron. Packag.   doi: 10.1115/1.4028994
Photogallery | June 2012
research-article | March 2013
research-article | March 2014
Research Paper | December 2011
research-article | June 2015
TECHNICAL PAPERS | September 2007
Boris Abramzon
J. Electron. Packag.   doi: 10.1115/1.2753959
AMR Podcast
January 01, 2015
Applied Mechanics Reviews Audio Interview: Prof. Katia Bertoldi
48 minutes, 04 seconds

Prof. Katia Bertoldi is the recipient of the Thomas J.R. Hughes Young Investigator Award from ASME and a Journal of Applied Mechanics Paper Award, both in 2014. This AMR audio interview explores her professional development, experiences, and insights as a student and later academic researcher and mentor, and describes her contributions to the accidental and purposeful invention of engineered materials with local structural properties that govern macroscopic material response, with applications to energy dissipation, energy focusing, and wave guiding.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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