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Journal of Electronic Packaging

Newest Issue: (September 2015, Volume 137, Issue 3)
FOREWORD | June 2003
J. Electron. Packag.   doi: 10.1115/1.1568123
Photogallery | June 2012
Book Review | March 2010
James W. Dally, Pradeep Lall, Jeffrey C. Suhling and John H. L. Pang
J. Electron. Packag.   doi: 10.1115/1.4000755
Photogallery | June 2012
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
Review Article | December 2014
research-article | March 2015
Pradeep Lall, Sandeep Shantaram, Jeff Suhling and David Locker
J. Electron. Packag.   doi: 10.1115/1.4028641
research-article | June 2015
Sandesh S. Chougule and S. K. Sahu
J. Electron. Packag.   doi: 10.1115/1.4028994
AMR Podcast
May 04, 2015
Applied Mechanics Reviews Audio Interview: Prof. Igor Mezic
39 minutes, 14 seconds

Prof. Igor Mezic applies advanced methods of nonlinear dynamics and ergodic theory to the study of robust uncertainty management in complex networks and data assimilation in geophysical fluid dynamics. This AMR audio interview describes his path to a career of cutting-edge scientific research and engineering education, including his leadership in university-industry partnerships, his development of large-data diagnostic tools for forecasting coastal contamination from the 2010 Gulf oil spill, and his work on developing a curriculum in building energy efficiency.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Impact Factor (5 yr):0.751

2013 Journal Citation Reports® by Thomson Reuters, 2014

Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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