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Journal of Electronic Packaging

Newest Issue: (March 2015, Volume 137, Issue 1)
Photogallery | June 2012
research-article | March 2015
Photogallery | June 2012
Dustin W. Demetriou and H. Ezzat Khalifa
J. Electron. Packag.   doi: 10.1115/1.4005907
research-article | March 2013
Photogallery | June 2012
research-article | March 2013
research-article | March 2014
Chaoran Yang, Fubin Song and S. W. Ricky Lee
J. Electron. Packag.   doi: 10.1115/1.4025915
research-article | March 2014
Jason Stafford and Florian Fortune
J. Electron. Packag.   doi: 10.1115/1.4026351
AMR Podcast
October 03, 2014
Applied Mechanics Reviews Audio Interview: Dr. Irene Beyerlein
44 minutes, 46 seconds

Dr. Irene Beyerlein co-directs the Los Alamos Center for Materials at Irradiation and Mechanical Extremes and is a leading international expert on microstructural changes to metals undergoing severe plastic deformation. This AMR audio interview explores her path to a high-impact research career, her passion for the science of material dislocations and fracture, and the influence of role models and mentors.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398
CODEN: JEPAE4

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