Journal of Electronic Packaging

Newest Issue: (June 2015, Volume 137, Issue 2)
Photogallery | June 2012
Photogallery | June 2012
Review Article | March 2015
Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski and Darin Sharar
J. Electron. Packag.   doi: 10.1115/1.4028890
research-article | March 2013
Technical Brief | March 2015
research-article | June 2015
research-article | March 2015
Matthew Redmond and Satish Kumar
J. Electron. Packag.   doi: 10.1115/1.4028254
research-article | September 2014
K. Pramod and A. K. Sen
J. Electron. Packag.   doi: 10.1115/1.4027657
AMR Podcast
November 01, 2014
Applied Mechanics Reviews Audio Interview: Prof. Philip Holmes
47 minutes, 21 seconds

Prof. Philip Holmes is an internationally prominent mathematician and engineer whose fundamental contributions to the theory and applications of nonlinear dynamical systems span solid and fluid mechanics, animal locomotion, neuroscience, and cognition. This AMR audio interview describes an unconventional path from writing poetry in the Yorkshire Dales to writing the seminal textbook Nonlinear Oscillations, Dynamical Systems, and Bifurcations of Vector Fields with John Guckenheimer, for which the authors were awarded the American Mathematical Society Leroy P. Steele Prize for Mathematical Exposition in 2013.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Frequency: Quarterly
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1528-9044
eISSN: 1043-7398

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