Journal of Electronic Packaging

Newest Issue: (December 2018, Volume 140, Issue 4)
Review Article | September 2016
John H. Lau
   doi: 10.1115/1.4034037
Review Article | June 2016
Review Article | June 2016
Yu Wang, Zhengwei Li and Jianliang Xiao
   doi: 10.1115/1.4032984
research-article | June 2016
Review Article | September 2017
Kaysar Rahim and Ahsan Mian
   doi: 10.1115/1.4036239
Review Article | December 2015
Avram Bar-Cohen, Kaiser Matin and Sreekant Narumanchi
   doi: 10.1115/1.4031602
Review Article | March 2015
Review Article | March 2018
AMR Podcast
February 21, 2017
Applied Mechanics Reviews Audio Interview: Prof. Emeritus Simon Ostrach
50 minutes, 09 seconds

Recognized by NASA as a giant in heat transfer research, Prof. Simon Ostrach received the inaugural ASME Heat Transfer Division Memorial Award in 1975 and attained membership in the National Academy of Engineering in 1978 for his fundamental discoveries in the field of buoyancy-driven convection. This AMR audio interview paints a remarkable picture of six decades of intellectual leadership and advocacy, including his work as principal investigator on two NASA Spacelab missions in 1992 and 1995 that investigated surface-tension driven convection under microgravity conditions, his commitment to the rigorous integration of research and design, and his, at one time, insatiable appetite for the thrills of weightless flight on the NASA “Vomit Comet.”

About This Journal
Most Accessed Article in 2017

ASME announces the 2017 Reviewers of the Year

JEP Best Paper Award:

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional ICs: from Back-Side to Volumetric Heat Removal, by Thomas Brunschwiler, Research Staff Member, Arvind Sridhar, Postdoctoral Researcher, Gerd Schlottig, Researcher (IBM Research, Zürich Area, Switzerland), Chin Lee Ong, (Senior Collaborater at EPFL, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland).


The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Journal Impact Factor:2.21

2017 Journal Citation Reports ® (Clarivate Analytics, 2018)

Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
ISSN: 1043-7398
eISSN: 1528-9044

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