Journal of Electronic Packaging

Newest Issue: (March 2017, Volume 139, Issue 1)
Review Article | June 2016
Review Article | June 2016
Yu Wang, Zhengwei Li and Jianliang Xiao
   doi: 10.1115/1.4032984
Review Article | September 2016
John H. Lau
   doi: 10.1115/1.4034037
Review Article | December 2015
Avram Bar-Cohen, Kaiser Matin and Sreekant Narumanchi
   doi: 10.1115/1.4031602
research-article | June 2016
Review Article | March 2015
Review Article | June 2016
Review Article | September 2016
AMR Podcast
June 01, 2016
Applied Mechanics Reviews Audio Interview: Prof. Rodney Clifton
32 minutes, 40 seconds

Prof. Rodney Clifton is among the pioneers in the development of experimental techniques for characterizing high-strain-rate material response, recognized with membership in the National Academy of Engineering in 1989 and the ASME Timoshenko Medal in 2000. This AMR audio interview tells his story from a modest background in a one-room country school, through his labor on the early construction of Interstate 80 in Nebraska, to research on computational techniques for wave propagation in elastic-plastic materials, innovative approaches to characterizing the viscoelastic response of vocal folds, and a life-long commitment to teaching and learning.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Impact Factor (5 yr):1.103

2015 Journal Citation Reports ® by Thomson Reuters, 2016

Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1043-7398
eISSN: 1528-9044

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