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Journal of Electronic Packaging

Newest Issue: (September 2016, Volume 138, Issue 3)
Review Article | December 2015
Avram Bar-Cohen, Kaiser Matin and Sreekant Narumanchi
   doi: 10.1115/1.4031602
Review Article | June 2016
Review Article | March 2015
research-article | June 2016
Review Article | June 2016
Yu Wang, Zhengwei Li and Jianliang Xiao
   doi: 10.1115/1.4032984
Review Article | June 2016
AMR Podcast
May 04, 2016
Applied Mechanics Reviews Audio Interview: Prof. Thomas Hughes
49 minutes, 41 seconds

Prof. Thomas J.R. Hughes is a leading authority in engineering science and applied mechanics, recognized for his ground-breaking contributions to the computer-aided analysis of problems in fluid and solid mechanics. This AMR audio interview explores his experiences at the interfaces between research and design, academia and industry, and innovation and integration, his unique combination of gumption and curiosity, and how a flailing fire hose may have inspired a revolution in vascular surgery.

About This Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Impact Factor (5 yr):0.842

2014 Journal Citation Reports ® by Thomson Reuters, 2015

Frequency:Quarterly
Scope:
Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems.
ISSN: 1043-7398
eISSN: 1528-9044
CODEN: JEPAE4

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