Journal of Electronic Packaging

Newest Issue: (December 2018, Volume 140, Issue 4)
Review Article | September 2016
John H. Lau
   doi: 10.1115/1.4034037
Review Article | December 2018
Review Article | June 2016
Review Article | March 2018
research-article | June 2016
research-article | March 2018
Ercan M. Dede, Feng Zhou, Paul Schmalenberg and Tsuyoshi Nomura
   doi: 10.1115/1.4039020
Review Article | June 2016
Yu Wang, Zhengwei Li and Jianliang Xiao
   doi: 10.1115/1.4032984
Review Article | September 2017
Kaysar Rahim and Ahsan Mian
   doi: 10.1115/1.4036239
Review Article | September 2016
AMR Podcast
August 24, 2018
Applied Mechanics Reviews Audio Interview: Prof. Wei Chen
59 minutes, 41 seconds

Prof. Wei Chen of Northwestern University is a pillar of the ASME design automation and design engineering communities and an exceptionally prolific contributor to the science of engineering design since obtaining her PhD in 1995. This AMR audio interview reflects on her long record of professional service, most recently as Editor of the Journal of Mechanical Design, and her perspectives on the power of interdisciplinary collaboration in promoting advances in predictive science, the integration of design in undergraduate engineering curricula, and how consumer choice may be influenced by purposeful design.

About This Journal
Most Accessed Article in 2018
Recent Advances and New Trends in Flip Chip Technology

Most Accessed Article in 2017

ASME announces the 2017 Reviewers of the Year

JEP Best Paper Award:

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional ICs: from Back-Side to Volumetric Heat Removal, by Thomas Brunschwiler, Research Staff Member, Arvind Sridhar, Postdoctoral Researcher, Gerd Schlottig, Researcher (IBM Research, Zürich Area, Switzerland), Chin Lee Ong, (Senior Collaborater at EPFL, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland).


The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Editor:  Y. C. Lee,
University of Colorado, Boulder
View Full Editorial Board
Journal Impact Factor:2.21

2017 Journal Citation Reports ® (Clarivate Analytics, 2018)

Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
ISSN: 1043-7398
eISSN: 1528-9044

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