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Research Papers

J. Electron. Packag. 2018;140(4):041001-041001-9. doi:10.1115/1.4040552.

Flexible printed circuit boards (PCBs) make it possible for engineers to design devices that use space efficiently and can undergo changes in shape and configuration. However, they also suffer from tradeoffs due to nonideal material properties. Here, a method is presented that allows engineers to introduce regions of flexibility in otherwise rigid PCB substrates. This method employs geometric features to reduce local stiffness in the PCB, rather than reducing the global stiffness by material selection. Analytical and finite element models are presented to calculate the maximum stresses caused by deflection. An example device is produced and tested to verify the models.

Commentary by Dr. Valentin Fuster

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