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J. Electron. Packag. 2017;139(4):041001-041001-9. doi:10.1115/1.4037221.

This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.

Commentary by Dr. Valentin Fuster
J. Electron. Packag. 2017;139(4):041002-041002-8. doi:10.1115/1.4037276.

Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and wire sag problems become more and more serious. Based on some types of frequently used stacked configurations, their corresponding wire sweep and wire sag stiffness and deflections are investigated for extra-high stacked layers. Two typical profiles of Q_loop and S_loop wire bonds are included in this study. However, wire sweep and wire sag have to be considered in two different design aspects. For wire sweep, we have the conclusion that the maximum wire sweep deflections always occur near the central segment of a wire bond. As for the wire sag, the maximum wire sag may take place in the center region of the straight portion of a wire bond. The result shows that the deflections of wire sag can be reduced significantly by simply shifting the position of the kink or bend created within a wire bond. Finally, we have concluded that a stacked configuration with smallest bond span may be the preferred selection for the concerns of wire sweep and wire sag issues.

Topics: Wire , Deflection
Commentary by Dr. Valentin Fuster

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