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Research Papers

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

[+] Author and Article Information
Hsiu-Ping Wei

Department of Mechanical Engineering,
University of Maryland,
College Park, MD 20742

Yu-Hsiang Yang

Department of Mechanical Engineering,
University of Maryland,
College Park, MD 20742

Bongtae Han

Department of Mechanical Engineering,
University of Maryland,
College Park, MD 20742
e-mail: bthan@umd.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 4, 2019; final manuscript received June 20, 2019; published online August 1, 2019. Assoc. Editor: Kaushik Mysore.

J. Electron. Packag 142(1), 011002 (Aug 01, 2019) (10 pages) Paper No: EP-19-1029; doi: 10.1115/1.4044218 History: Received March 04, 2019; Revised June 20, 2019

The stochastic model for yield loss prediction proposed in Part I is implemented for a package-on-package (PoP) assembly. The assembly consists of a stacked die thin flat ball grid array (TFBGA) as the top package and a flip chip ball grid array (fcBGA) as the bottom package. The top and bottom packages are connected through 216 solder joints of 0.5 mm pitch in two peripheral rows. The warpage values of the top and bottom package are calculated by finite element analysis (FEA), and the corresponding probability of density functions (PDFs) are obtained by the eigenvector dimension reduction (EDR) method. The solder ball heights of the top and bottom package and the corner pad joint heights are determined by surface evolver, and their PDFs are determined by the EDR method, too. Only 137 modeling runs are conducted to obtain all 549 PDFs in spite of the large number of input variables considered in the study (27 input variables). Finally, the noncontact open-induced staking yield loss of the PoP assembly is predicted from the PDFs.

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References

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Figures

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Fig. 1

Package-on-Package assembly used in the study [1]

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Fig. 2

Details of the FEA model of (a) top TFBGA package and (b) bottom fcBGA package

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Fig. 3

Deformed configurations (5× magnification) of (a) the top and (b) the bottom packages with the nominal design parameters at the peak reflow temperature

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Fig. 4

PDFs of warpage at the outmost corner pad

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Fig. 5

Statistical correlations of the warpages at the jth pad and the outmost corner pad: (a) pad locations, (b) top package, and (c) bottom package

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Fig. 6

Cross-sectional view of a PoP using the BoB approach just prior to reflow

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Fig. 7

Solder balls geometry of (a) the first reflow process and (b) the second reflow during stacking

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Fig. 8

Shape prediction results of (a) the top and (b) bottom solder balls after the first reflow, and (c) the solder joint after the second reflow

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Fig. 9

(a) PDF of the top solder ball height, (b) PDF of the bottom solder ball height, and (c) PDF of the solder joint height

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Fig. 10

Procedure of stacking yield prediction by MCS

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Fig. 11

Interference of PDFs of load and strength for the 109th pad (j = 109) for a single MCS run: (a) scenario-1 and (b) scenario-4

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Fig. 12

(a) PDF of gap at the 109th pad and (b) the enlarged view of the tail-end marked by the red box in (a)

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Fig. 13

Regions of ball pads having noncontact opens for all of the MCS runs

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