Guest Editorial

Special Issue on InterPACK 2018 PUBLIC ACCESS

[+] Author and Article Information
Ercan M. Dede

Electronics Research Department,
Toyota Research Institute of North America,
Ann Arbor, MI 48105

Lauren Boteler

U.S. Army Research Laboratory,
Adelphi, MD 20783

Changqing Chen

Wuhan National Laboratory for Optoelectronics,
Huazhong University of Science and Technology,
Wuhan 430074, China

Przemyslaw Jakub Gromala

Robert Bosch GmbH Germany,
Reutlingen 72703, Germany

Benjamin Leever

Air Force Research Laboratory,
Wright-Patterson Air Force Base, OH 45324

Wei Li

Department of Energy Engineering,
Zhejiang University China,
Zhejiang 310027, China

This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions.

J. Electron. Packag 141(3), 030301 (May 08, 2019) (1 page) Paper No: EP-19-1036; doi: 10.1115/1.4043484 History: Received March 26, 2019; Revised April 02, 2019

The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Founded in 1992, InterPACK is the flagship conference for the American Society of Mechanical Engineers (ASME) Electronic and Photonic Packaging Division (EPPD). The InterPACK 2018 conference was held in San Francisco, CA, Aug. 27–30.

With nearly 185 technical papers and presentations, InterPACK 2018 reflected the changing landscape of electronics and photonics packaging as it pertains to the internet of things and efficient power delivery. Accordingly, the conference consisted of five technical tracks including: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, internet of things, and edge to cloud, (3) structural and physical health monitoring, (4) power electronics, energy conversion, and storage, and (5) autonomous, hybrid, and electric vehicles.

This Special Issue of the ASME Journal of Electronic Packaging (JEP) was compiled based on recommendations from the peer review of the conference papers and from manuscripts submitted by authors of technical papers and presentations from the postconference open solicitation. All submitted manuscripts were subject to an independent peer-review process in accordance with the editorial standards of the ASME JEP. The accepted articles cover the topics of IT/data center design, electronics condition monitoring, light-emitting diode package design, device/package thermal management and reliability, and heat transfer with phase-change.

It is expected that this collection of papers will serve as a high quality, informative resource for EPPD members, as well as, the broader engineering community. We would like to sincerely thank all of the authors who contributed to this Special Issue and the reviewers who provided critical feedback for the enhancement of the final manuscripts. Kaustubh Nagarkar and Professor Y. C. Lee deserve further acknowledgment as the InterPACK 2018 General Conference Chair and the JEP editor, respectively.

We wish you the very best as you read through the JEP InterPACK 2018 Special Issue.

Copyright © 2019 by ASME
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