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Review Article

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

[+] Author and Article Information
Sinan Su

Department of Industrial and
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849

Francy John Akkara, Ravinder Thaper

Department of Industrial and
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849

Atif Alkhazali, Mohammad Hamasha

Department of Industrial Engineering,
The Hashemite University,
Az-Zarqa 13133, Jordan

Sa'd Hamasha

Department of Industrial and
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849
e-mail: smh0083@auburn.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 18, 2018; final manuscript received March 27, 2019; published online May 17, 2019. Assoc. Editor: Tse Eric Wong.

J. Electron. Packag 141(4), 040802 (May 17, 2019) (13 pages) Paper No: EP-18-1117; doi: 10.1115/1.4043405 History: Received December 18, 2018; Revised March 27, 2019

Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

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