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Review Article

Thermo-Mechanical Interaction between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile PC Platforms

[+] Author and Article Information
Aastha Uppal

Intel Corporation, 5000 W. Chandler Blvd, CH5-157, Chandler, AZ 85226
aastha.uppal@intel.com

Jerrod Peterson

Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124
jerrod.peterson@intel.com

Je-Young Chang

Intel Corporation, 5000 W. Chandler Blvd, CH5-157, Chandler, AZ 85226
je-young.chang@intel.com

Xi Guo

Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124
xi.guo@intel.com

Frank Z. Liang

Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124
frank.z.liang@intel.com

Weihua Tang

Intel Corporation, 5000 W. Chandler Blvd, CH5-157, Chandler, AZ 85226
weihua.tang@intel.com

1Corresponding author.

ASME doi:10.1115/1.4042801 History: Received July 02, 2018; Revised December 07, 2018

Abstract

The demands for both thinner bare-die BGA packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with SoC packages in mobile PC platforms. The thermo-mechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: 1) an in-depth thermo-mechanical characterization to understand their impacts on product quality and performance, and 2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermo-mechanical trade-offs for optimal design spaces for next-generation mobile PC platforms.

Copyright (c) 2019 by ASME
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