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Research Papers

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

[+] Author and Article Information
Hsien-Chie Cheng

Mem. ASME
Department of Aerospace and Systems
Engineering,
Feng Chia University,
Taichung 407, Taiwan
e-mail: hccheng@fcu.edu.tw

Ruei-You Hong

Department of Power Mechanical Engineering,
National Tsing Hua University,
Hsinchu 300, Taiwan

Wen-Hwa Chen

Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University,
Hsinchu 300, Taiwan
e-mail: whchen@pme.nthu.edu.tw

1Corresponding authors.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received May 29, 2018; final manuscript received July 19, 2018; published online September 10, 2018. Assoc. Editor: Satish Chaparala.

J. Electron. Packag 140(4), 041007 (Sep 10, 2018) (10 pages) Paper No: EP-18-1041; doi: 10.1115/1.4041014 History: Received May 29, 2018; Revised July 19, 2018

In this work, the elastic–plastic properties of the printed interconnects on a glass substrate with Ag-filled polymer-conductor ink are evaluated through a theoretical framework based on finite element (FE) modeling of instrumented sharp indentation, experimental indentation, the concept of the representative strain, and dimensional analysis. Besides, the influences of the ink-solvent content and temperature on the elastic–plastic and electrical properties of the printed Ag-based interconnects are also addressed. First of all, parametric FE indentation analyses are carried out over a wide range of elastic–plastic material parameters. These parametric results together with the concept of the representative strain are used via dimensional analysis to constitute a number of dimensionless functions, and further the forward/reverse algorithms. The forward algorithm is used for describing the indentation load–depth relationship and the reverse for predicting the elastic–plastic parameters of the printed Ag-based interconnects. The proposed algorithms are validated through the correct predictions of the plastic properties of three known metals. At last, their surface morphology, microstructure, and elemental composition are experimentally characterized. Results show that the elastic–plastic properties and electrical sheet resistance of the printed Ag-based interconnects increase with the ink-solvent content, mainly due to the increase of carbon element as a result of the increased ink-solvent residue, whereas their elastic–plastic properties and electrical performance decreases with the temperature.

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References

Tummala, V. S. , Mian, A. , Chamok, N. H. , Poduval, D. , Ali, M. , Clifford, J. , and Majumdar, P. , 2017, “ Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications,” ASME J. Electron. Packag., 139(2), p. 020904. [CrossRef]
Cheng, H.-C. , Chen, Y.-W. , Chen, W.-H. , Lu, S.-T. , and Lin, S.-M. , 2018, “ Assessing Ink Transfer Performance of Gravure Offset Fine Line Circuitry Printing,” J. Electron. Mater., 47(3), pp. 1832–1846. [CrossRef]
Liao, L.-L. , and Chiang, K.-N. , 2017, “ Nonlinear and Temperature-Dependent Material Properties of Au/Sn Intermetallic Compound,” J. Mech., 33(5), pp. 663–672. [CrossRef]
Klein, S. A. , Aleksov, A. , Subramanian, V. , Malatkar, P. , and Mahajan, R. , 2017, “ Mechanical Testing for Stretchable Electronics,” ASME J. Electron. Packag., 139(2), p. 020905. [CrossRef]
Oliver, W. C. , and Pharr, G. M. , 1992, “ An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments,” J. Mater. Res., 7(6), pp. 1564–83. [CrossRef]
Song, J.-M. , Shen, Y.-L. , Su, C.-W. , Lai, Y.-S. , and Chiu, Y.-T. , 2009, “ Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints With Cu and Ag Substrates,” Mater. Trans., 50(5), pp. 1231–1234. [CrossRef]
Liu, H. , and McBride, J. W. , ” 2017, “ Finite-Element Contact Modeling of Rough Surfaces Applied to Au-Coated Carbon Nanotube Composites,” IEEE Trans. Compon., Packag. Manuf. Technol., 7(3), pp. 329–337. [CrossRef]
Hsu, Y. Y. , Papakyrikos, C. , Liu, D. , Wang, X. Y. , Raj, M. , Zhang, B. S. , and Ghaffari, R. , 2014, “ Design for Reliability of Multi-Layer Stretchable Interconnects,” J. Micromech. Microeng., 24(9), p. 095014. [CrossRef]
Cheng, H.-C. , Huang, H.-H. , Chen, W.-H. , and Lu, S.-T. , 2015, “ Hygro-Thermo-Mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging,” J. Electron. Mater., 44(4), pp. 1220–1237. [CrossRef]
Cheng, Y.-T. , and Cheng, C.-M. , 1998, “ Relationships Between Hardness, Elastic Modulus, and the Work of Indentation,” Appl. Phys. Lett., 73(5), pp. 614–616. [CrossRef]
Dao, M. , Chollacoop, N. , Van Vliet, K. J. , Venkatesh, T. A. , and Suresh, S. , 2001, “ Computational Modeling of the Forward and Reverse Problems in Instrumented Sharp Indentation,” Acta Mater., 49(19), pp. 3899–3918. [CrossRef]
Deng, X. , Chawla, N. , Chawla, K.-K. , and Koopman, M. , 2004, “ Deformation Behavior of (Cu, Ag)-Sn Intermetallics by Nanoindentation,” Acta Mater., 52(14), pp. 4291–4303. [CrossRef]
Cao, Y. P. , and Lu, J. , 2004, “ A New Method to Extract the Plastic Properties of Metal Materials From an Instrumented Spherical Indentation Loading Curve,” Acta Mater., 52(13), pp. 4023–4032. [CrossRef]
Antunes, J.-M. , Fernandes, J.-V. , Menezes, L.-F. , and Chaparro, B.-M. , 2007, “ A New Approach for Reverse Analyses in Depth-Sensing Indentation Using Numerical Simulation,” Acta Mater., 55(1), pp. 69–81. [CrossRef]
Lee, J. , Lee, C. , and Kim, B. , 2009, “ Reverse Analysis of Nano-Indentation Using Different Representative Strains and Residual Indentation Profiles,” Mater. Des., 30(9), pp. 3395–3404. [CrossRef]
Cheng, H.-C. , Hu, H.-C. , Hong, R.-Yo , and Chen, W.-H. , 2018, “ Investigation of Stress-Strain Constitutive Behavior of Intermetallic Alloys,” J. Mech., 34(03), pp. 349–361. [CrossRef]
Tabor, D. , 2000, The Hardness of Metals, Oxford University Press, Oxford, UK.
Giannakopoulos, A. E. , and Suresh, S. , 1999, “ Determination of Elastoplastic Properties by Instrumented Sharp Indentation,” Scr. Mater., 40(10), pp. 1191–1198. [CrossRef]
Ogasawara, N. , 2005, “ Representative Strain of Indentation Analysis,” J. Mater. Res., 20(8), pp. 2225–2234. [CrossRef]
Pharr, G. M. , 1998, “ Measurement of Mechanical Properties by Ultra Low Load Indentation,” Mater. Sci. Eng. A, 253(1–2), pp. 151–159. [CrossRef]
Takagi, H. , Dao, M. , Fujiwara, M. , and Otsuka, M. , 2003, “ Experimental and Computational Creep Characterization of Al–Mg Solid-Solution Alloy Through Instrumented Indentation,” Philos. Mag., 83(35), pp. 3959–3976. [CrossRef]
Sharma, G. , Ramanujan, R. V. , Kutty, T. R. G. , and Prabhu, N. , 2005, “ Indentation Creep Studies of Iron Aluminide Intermetallic Alloy,” Intermetallics, 13(1), pp. 47–53. [CrossRef]
Wu, W. , Qin, F. , An, T. , and Chen, P. , 2016, “ A Study of Creep Behavior of TSV-Cu Based on Nanoindentaion Creep Test,” J. Mech., 32(6), pp. 717–724. [CrossRef]
King, R. B. , 1987, “ Elastic Analysis of Some Punch Problems for a Layered Medium,” Int. J. Solids Struct., 23(12), pp. 1657–1664. [CrossRef]
Matikainen, A. , Nuutinen, T. , Itkonen, T. , Heinilehto, S. , Puustinen, J. , Hiltunen, J. , Lappalaine, J. , Karioja, P. , and Vahimaa, P. , 2016, “ Atmospheric Oxidation and Carbon Contamination of Silver and Its Effect on Surface-Enhanced Raman Spectroscopy (SERS),” Sci. Rep., 6(1), pp. 1–5. [CrossRef] [PubMed]
Khirotdin, R. K. , Ngadiron, M. F. , Mahadzir, M. A. , and Hassan, N. , 2017, “ Performance Evaluation of Strain Gauge Printed Using Automatic Fluid Dispensing System on Conformal Substrates,” IOP Conf. Ser.: Mater. Sci. Eng., 226, p. 012019. [CrossRef]

Figures

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Fig. 1

An indentation load (S)–depth (l) relation of indentation

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Fig. 2

Stress–strain curve

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Fig. 3

The experimental and numerical instrumented sharp indentation: (a) indentation marks and (b) FE modeling of indentation

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Fig. 4

The relation between the ratio σr/P and σr/Er at different strain hardening exponents and plastic strains: (a) εr = 0.01, (b) εr = 0.05, and (c) εr = 0.29

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Fig. 5

The representations of U0/Erlm versus σ0.05/Er at n = 0 and 0.1: (a) n = 0 and (b) n = 0.1

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Fig. 6

The representations: (a) have/Er versus lr/lm and (b) U0/ErAm versus 1 − lr/lm

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Fig. 7

The forward/reverse methods: (a) forward method and (b) reverse method

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Fig. 8

The literature (experiment) and presently predicted indentation load-depth responses: (a) pure tin, (b) eutectic solder, and (c) Al6061-T6

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Fig. 9

The measured and presently predicted indentation load-depth responses for the three additional solvent contents at 25 °C: (a) 0%, (b) 5%, and (c) 10%

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Fig. 10

The stress–stain curves of the printed interconnects at 25 °C and 75 °C for the three additional solvent contents: (a) 25 °C and (b) 75 °C

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Fig. 11

Field emission scanning electron microscopy images of surface morphology of the printed Ag-based interconnects for the three additional solvent contents: (a) 0%, (b) 5%, and (c) 10%

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Fig. 12

Transmission electron microscopy images: (a) the printed interconnect (top) and the single grain (bottom) after sintering, (b) distribution of silver, and (c) distribution of carbon

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