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Technical Brief

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

[+] Author and Article Information
Richard C. Jaeger

Electrical & Computer Engineering,
Auburn University,
200 Broun Hall,
Auburn, AL 46849
e-mail: jaegerc@auburn.edu

Jeffrey C. Suhling

Mechanical Engineering,
Auburn University,
1418 Wiggins Hall,
Auburn, AL 46849
e-mail: jsuhling@auburn.edu

Jun Chen

Mechanical Engineering,
Auburn University,
1418 Wiggins Hall,
Auburn, AL 46849
e-mail: jzc0088@auburn.edu

1Analysis of the ±45 deg sensor is similar to that presented here.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 19, 2018; final manuscript received July 8, 2018; published online August 3, 2018. Assoc. Editor: Eric Wong.

J. Electron. Packag 140(4), 044501 (Aug 03, 2018) Paper No: EP-18-1013; doi: 10.1115/1.4040829 History: Received February 19, 2018; Revised July 08, 2018

The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), p. 041014; Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2018, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 140(1), p. 017001] was backed up by measurements and simulation results, but not mathematically proven. A proof based upon two-port impedance parameter reciprocity is presented with additional experimental confirmation.

FIGURES IN THIS ARTICLE
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Copyright © 2018 by ASME
Topics: Sensors , Stress
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References

Jaeger, R. C. , Motalab, M. , Hussain, S. , and Suhling, J. C. , 2014, “ Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), p. 041014. [CrossRef]
Jaeger, R. C. , Motalab, M. , Hussain, S. , and Suhling, J. C. , 2018, “ Erratum: ‘Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors’,” ASME J. Electron. Packag., 140(1), p. 017001. [CrossRef]
Mian, A. K. M. , Suhling, J. C. , and Jaeger, R. C. , 2006, “ The van der Pauw Stress Sensor,” IEEE Sens. J., 6(2), pp. 340–356. [CrossRef]
van der Pauw, L. J. , 1958, “ A Method of Measuring Specific Resistivity and Hall Effect of Disks of Arbitrary Shape,” Philips Res. Rep., 13, pp. 1–9.
Hayt, W. H. , Kemmerly, J. E. , and Durbin, S. M. , 2007, Engineering Circuit Analysis, 7th ed., McGraw-Hill, New York.
Jaeger, R. C. , Chen, J. , Suhling, J. C. , and Fursin, L. , 2018, “ Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide,” ASME Paper No. IPACK2018-8219.

Figures

Grahic Jump Location
Fig. 1

Stress extraction using measurements of two van der Pauw voltages VVDP0 and VVDP90: (a) 0 deg measurement (VVDP0) and (b) 90 deg measurement (VVDP90). (The Figure was updated to correct a sign error in Ref. [1]).

Grahic Jump Location
Fig. 2

(a) Diagonal-mode excitation of the van der Pauw stress sensor and (b) equivalent circuit with the current source in (a) split into two equal sources

Grahic Jump Location
Fig. 3

The van der Pauw sensor redrawn as a two-port

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