0
Review Article

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

[+] Author and Article Information
Justin Broughton

G. W. Woodruff School of Mechanical
Engineering,
Georgia Institute of Technology,
771 Ferst Drive,
Atlanta, GA 30332

Vanessa Smet, Rao R. Tummala

3D Systems Packaging Research Center,
Georgia Institute of Technology,
Atlanta, GA 30332

Yogendra K. Joshi

G. W. Woodruff School of Mechanical
Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: yogendra.joshi@me.gatech.edu

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 11, 2017; final manuscript received July 9, 2018; published online August 20, 2018. Assoc. Editor: Ercan Dede.

J. Electron. Packag 140(4), 040801 (Aug 20, 2018) (11 pages) Paper No: EP-17-1128; doi: 10.1115/1.4040828 History: Received December 11, 2017; Revised July 09, 2018

Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules.

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Figures

Grahic Jump Location
Fig. 1

Comparison of WBG materials' properties versus silicon [1]

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Fig. 2

Visualization of the several power conversion steps present in electric vehicles (traction inverter highlighted)

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Fig. 3

Typical power electronics packaging scheme

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Fig. 4

Standard power electronics packaging scheme seen in the 2004 Toyota Prius

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Fig. 5

2008 Lexus LS 600 h's double-sided cooling module

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Fig. 6

Power electronics packaging scheme in the 2010 Toyota Prius

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Fig. 7

Power electronics module in the 2012 Nissan Leaf

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Fig. 8

Direct substrate cooling in the 2014 Honda Accord

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Fig. 9

2016 Chevrolet Volt's double-sided cooling approach

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Fig. 10

Illustrations of the Nissan Leaf's inverter integrated into the housing, the “snaking” fins in the Chevy Volt, and the Honda Accord's machined fins (from left to right)

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Fig. 11

CTE versus Tm for various high-temperature die-attach technologies [36,39]

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Fig. 12

(a) one-sided CNT arrays, (b) two-sided arrays, and (c) CNT-coated foil array [56]

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Fig. 13

Representative schematics of inverters being cooled by (a) jet impingement, (b) spray cooling, and (c) microchannels

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