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Review Article

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

[+] Author and Article Information
Justin Broughton

G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332
justin.d.broughton@gatech.edu

Vanessa Smet

3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332
vanessa.smet@prc.gatech.edu

Rao Tummala

3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332
rao.tummala@ece.gatech.edu

Yogendra Joshi

G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332
yogendra.joshi@me.gatech.edu

1Corresponding author.

ASME doi:10.1115/1.4040828 History: Received December 11, 2017; Revised July 09, 2018

Abstract

Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles. Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and hybrid-electric vehicles. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation SiC power modules.

Copyright (c) 2018 by ASME
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