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Technical Brief

Micro copper pillar interconnection using thermosonic flip chip bonding

[+] Author and Article Information
Bo Wu

State Key Laboratory of High Performance, Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China
csuwubo@sina.com

Shuanghai Zhang

State Key Laboratory of High Performance, Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China
zhangshuanghai@csu.edu.cn

Fuliang Wang

State Key Laboratory of High Performance, Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China
wangfuliang@csu.edu.cn

Zhuo Chen

State Key Laboratory of High Performance, Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China
zhuochen@csu.edu.cn

1Corresponding author.

ASME doi:10.1115/1.4040794 History: Received February 28, 2018; Revised July 04, 2018

Abstract

The incorporation of a micro copper pillar is considered as the major interconnection method in three-dimensional integrated circuit intergradation under high-density I/O conditions. To achieve low-temperature bonding, this study investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 µm pillar bump, and substrate temperature of 200?. Additionally, the effect of the bonding force on bonding interface microstructure and intermetallic compounds was also investigated. Tin whiskers were also ob-served at the bonding interface at low bonding forces.

Copyright (c) 2018 by ASME
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