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research-article

Interfacial compounds characteristic and its reliability effects on SAC305 micro-joints in flip chip assemblies

[+] Author and Article Information
Ye Tian

School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou-450001, China; School of Materials Science and Engineering, HuaZhong University of Science and Technology, Wuhan-430074, China
yetian27@163.com

Ning Ren

School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou-450001, China
ningren001@126.com

Xiaoxia Jian

School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou-450001, China
jianxx08@163.com

Tie Geng

School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou-450001, China
tiegeng2000@163.com

Yiping Wu

School of Materials Science and Engineering, HuaZhong University of Science and Technology, Wuhan-430074, China
ypwu27@163.com

1Corresponding author.

ASME doi:10.1115/1.4040298 History: Received January 28, 2018; Revised May 12, 2018

Abstract

This study mainly focuses on site effects of the Ni pad interface on intermetallic compounds (IMCs) characteristic during assembly reflowing, and attempts to provide a reasonable explanation for this particular finding. Besides, the changes of the resulting IMCs characteristic are characterized during thermal shock (TS) cycling, and their potential influences on thermal-mechanical reliability of micro-joints are evaluated experimentally and numerically. The results showed that the site on the Ni pad interface of silicon chip has great influences on interfacial reaction products, i.e. interfacial IMCs. After bumps soldering, a great amount of larger diamond-shaped (Cu, Ni)6Sn5 compounds densely packed at the edge region, while some smaller ones only scattered at the center region. Moreover, substantial particle-shaped (Ni, Cu)3Sn4 compounds as well as some rod-shaped ones emerged at the spaces between the (Cu, Ni)6Sn5 compounds of the center region. More importantly, such site effects were remained in the micro-joints during TS cycling, which induced the formation of larger protruding (Cu, Ni)6Sn5 compounds. Finite-element simulation results showed that the stress was mainly concentrated at the top of the protruding (Cu, Ni)6Sn5 compounds, which can be a critical reason to cause the crack occurrence. Furthermore, the underlying mechanism of the interfacial IMCs characteristic induced by the site effects was attempted to propose during bumps soldering.

Copyright (c) 2018 by ASME
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