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research-article

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

[+] Author and Article Information
Chia-Cheng Chang

Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Sec. 2, Kungfu Rd. Hsinchu 300, Taiwan
cchiacheng@gmail.com

Sheng-Da Lin

Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Sec. 2, Kungfu Rd. Hsinchu 300, Taiwan
yh82502002@gmail.com

Kuo-Ning Chiang

Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Sec. 2, Kungfu Rd. Hsinchu 300, Taiwan
knchiang@pme.nthu.edu.tw

1Corresponding author.

ASME doi:10.1115/1.4040297 History: Received January 15, 2018; Revised May 09, 2018

Abstract

The fatigue characteristics of Microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied stress and predicting fatigue life accurately. In this study, a methodology was developed for the life prediction of a polysilicon microstructure under bending tests. Based on the fatigue experiments conducted by Hocheng and Hung [1-2], cantilever beams with different dimensions were remodeled with mesh control technology using finite element analysis (FEA) software to extract the stress magnitude. The mesh size, anchor boundary, loading boundary, critical stress definition and solution type were well modified to obtain more correct stress values. Based on the new stress data extracted from the modified models, the optimized stress-number of life curve (S-N curve) was obtained, and the new life-prediction equation was found to be referable for polysilicon thin film life prediction under bending loads. After comparing the literature and confirming the new models, the frequency effect was observed only for the force control type and not for the displacement control type.

Copyright (c) 2018 by ASME
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