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Research Papers

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

[+] Author and Article Information
Chia-Cheng Chang, Sheng-Da Lin

Department of Power Mechanical Engineering,
National Tsing Hua University,
No. 101, Sec. 2, Kungfu Road,
Hsinchu 300, Taiwan

Kuo-Ning Chiang

Department of Power Mechanical Engineering,
National Tsing Hua University,
No. 101, Sec. 2, Kungfu Road,
Hsinchu 300, Taiwan
e-mail: knchiang@pme.nthu.edu.tw

1Corresponding author.

Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda.

J. Electron. Packag 140(3), 031008 (Jun 26, 2018) (7 pages) Paper No: EP-18-1004; doi: 10.1115/1.4040297 History: Received January 15, 2018; Revised May 09, 2018

The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied stress and predicting fatigue life accurately. In this study, a methodology was developed for the life prediction of a polysilicon microstructure under bending tests. Based on the fatigue experiments conducted by Hocheng et al. (2008, “Various Fatigue Testing of Polycrystalline Silicon Microcantilever Beam in Bending,” Jpn. J. Appl. Phys., 47, pp. 5256–5261) and (Hung and Hocheng, 2012, “Frequency Effects and Life Prediction of Polysilicon Microcantilever Beams in Bending Fatigue,” J. Micro/Nanolithogr., MEMS MOEMS, 11, p. 021206), cantilever beams with different dimensions were remodeled with mesh control technology using finite element analysis (FEA) software to extract the stress magnitude. The mesh size, anchor boundary, loading boundary, critical stress definition, and solution type were well modified to obtain more correct stress values. Based on the new stress data extracted from the modified models, the optimized stress-number of life curve (S–N curve) was obtained, and the new life-prediction equation was found to be referable for polysilicon thin film life prediction under bending loads. After comparing the literature and confirming the new models, the frequency effect was observed only for the force control type and not for the displacement control type.

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References

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Figures

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Fig. 1

(a) Deflection behavior for a loading on the free end [16] and (b) free body diagram for a cantilever beam [16]

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Fig. 2

(a) Scanning electron microscope image of microcantilever beam [9] and (b) experimental setup schematic drawing [9]

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Fig. 3

S–N curves from (a) Hocheng et al. [8] and (b) Hung and Hocheng [9]

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Fig. 4

(a) Original FEA model from Hung and Hocheng [9] and (b) modified FEA model in this study

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Fig. 5

(a) Line displacement at the free edge and (b) 1-μm diameter displacement at the groove center

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Fig. 6

Result of convergence test

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Fig. 7

New S–N curves for (a) Hocheng et al.'s [8] work and (b) Hung and Hocheng's [9] work

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Fig. 8

Combination of two S–N curves: (a) old results from the study of Hung's and co-workers [8,9] and (b) new results from the modified model

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Fig. 9

The loading curves of (a) force control type and (b) displacement control type

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Fig. 10

Dynamic stress distribution in the transient analysis

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Fig. 11

Maximum stress responses of the displacement control type at: (a) 100 Hz and (b) 40 kHz

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Fig. 12

Maximum stress responses of the force control type at: (a) 100 Hz and (b) 40 kHz

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Fig. 13

Stress-life cycle comparison for different frequency conditions

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Fig. 14

Stress comparison in early stage for different force-control frequencies

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