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research-article

Hybrid Nanocomposite Thermal Interface Materials: the Thermal Conductivity and the Packing Density

[+] Author and Article Information
Tingting Zhang

Department of Mechanical Engineering and Institute for Materials Research, Binghamton University, State University of New York, Binghamton, NY, 13902, USA
tzhang20@binghamton.edu

Bahgat Sammakia

Department of Mechanical Engineering and Institute for Materials Research, Binghamton University, State University of New York, Binghamton, NY, 13902, USA
bahgat@binghamton.edu

Zhihao Yang

School of Materials Science and Energy Engineering, Foshan University, Foshan, Guangdong, 528000, China
pvtech@qq.com

Howard Wang

Department of Mechanical Engineering and Institute for Materials Research, Binghamton University, State University of New York, Binghamton, NY, 13902, USA; Department of Materials Science and Engineering, University of Maryland, College Park, MD, 20742, USA
wangh@umd.edu

1Corresponding author.

ASME doi:10.1115/1.4040204 History: Received October 15, 2017; Revised April 09, 2018

Abstract

We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network form while AgNPs and AgNFs fuse to join bigger CuMPs upon hot compression, resulting in superior thermal and mechanical performances. The assembly temperature is as low as 125 oC due to the size effect of silver nano-particulates. The thermal conductivity, k, of the hybrid nanocomposite TIMs is found to be in the range of 15 - 140 W/mK, exceeding best-performing commercial thermal greases, while comparable to high-end solder TIMs. The dependence of k on the solid packing density and the volume fraction of voids is discussed through comparing to model predictions.

Copyright (c) 2018 by ASME
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