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research-article

Modelling of Moisture Transport into an Electronic Enclosures Using RC Approach

[+] Author and Article Information
Zygimantas Staliulionis

Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby, Denmark
zygsta@mek.dtu.dk

Helene Conseil-Gudla

Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby, Denmark
helco@mek.dtu.dk

Sankhya Mohanty

Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby, Denmark
samoh@mek.dtu.dk

Masoud Jabbari

Warwick Manufacturing Group (WMG), University of Warwick, Coventry CV4 7AL, UK
M.Jabbaribehnam@warwick.ac.uk

Rajan Ambat

Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby, Denmark
ram@mek.dtu.dk

Hattel Jesper Henri

Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby, Denmark
jhat@mek.dtu.dk

1Corresponding author.

ASME doi:10.1115/1.4039790 History: Received April 30, 2017; Revised March 16, 2018

Abstract

The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using the well-known Resistor-Capacitor (RC) method, which is efficient with computation time and resources; a requirement that has typically been a hindrance to the usage of conventional CFD or FEM approaches. The paper covers moisture build-up inside electronic enclosure when exposed to a constant and cyclic ambient moisture concentration and temperature. The model couples a lumped analysis of moisture transport into a box interior with a modified 1-D analogy of Fick’s second law for diffusion in the walls of the box. To model moisture transport under non-isothermal conditions, the moisture RC circuit is coupled with a thermal RC circuit. Under isothermal conditions, the impact of imperfections in the enclosure on the whole diffusion process was analyzed. Additionally, study of the impact of wall thickness, initial conditions in the wall and different diffusion coefficient was accomplished. The experimental and modelling results show that diffusion is the key factor for moisture diffusion through the wall and the imperfections with certain limits, do not have a significant effect on interior moisture response. Under non-isothermal conditions, the internal moisture oscillations follow temperature change albeit with a delay. It is also slightly dependent on ambient moisture oscillations, however such effects are not dominant until equilibrium is reached.

Copyright (c) 2018 by ASME
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