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research-article

Embedded Two-Phase Cooling of High Flux Electronics via Press-Fit and Bonded FEEDS Coolers

[+] Author and Article Information
Mandel Raphael

Smart and Small Thermal Systems Laboratory, Department of Mechanical Engineering, University of Maryland College Park, MD 20742
rmandel@umd.edu

Bae Daniel

Smart and Small Thermal Systems Laboratory, Department of Mechanical Engineering, University of Maryland College Park, MD 20742
bgp723@umd.edu

Ohadi Michael

Smart and Small Thermal Systems Laboratory, Department of Mechanical Engineering, University of Maryland College Park, MD 20742
ohadi@umd.edu

1Corresponding author.

ASME doi:10.1115/1.4039264 History: Received September 14, 2017; Revised January 31, 2018

Abstract

The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and reduces pumping power. To achieve maximum benefit, high heat fluxes and vapor qualities should be achieved simultaneously. While many researchers have achieved heat fluxes in excess of 1 kW/cm2, vapor qualities are often below 10%, requiring a significantly large amount of energy spent on sub-cooling or pumping power, which minimizes the benefit of using two-phase thermal transport. In this work, we describe our recent work with cooling devices utilizing Film Evaporation with an Enhanced fluid Delivery System, known as FEEDS. The design, calibration, and experimental testing of a press-fit and bonded FEEDS test section are detailed here. Heat transfer and pressure drop performance was characterized and discussed. With the press-fit Si test chip, heat fluxes in excess of 1 kW/cm2 were obtained at vapor qualities approaching 45% and a coefficient of performance approaching 1400. With the bonded SiC test chip, heat fluxes in excess of 1 kW/cm2 were achieved at a vapor quality of 85% and heat densities approaching 490 W/cm3.

Copyright (c) 2018 by ASME
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