0
research-article

Thermal Metamaterials for Heat Flow Control in Electronics

[+] Author and Article Information
Ercan M. Dede

Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, Michigan 48105
eric.dede@toyota.com

Feng Zhou

Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, Michigan 48105
feng.zhou@toyota.com

Paul Schmalenberg

Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, Michigan 48105
paul.schmalenberg@toyota.com

Tsuyoshi Nomura

Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, Michigan 48105
tsuyoshi.nomura@toyota.com

1Corresponding author.

ASME doi:10.1115/1.4039020 History: Received September 22, 2017; Revised December 19, 2017

Abstract

Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal metamaterial systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electro-thermal circuit design are the primary focus, some discussion on the extension of thermal-guiding structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.

Copyright (c) 2018 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In