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research-article

Ripening growth kinetics of Cu6Sn5 grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu solder joints during the reflow process

[+] Author and Article Information
Yu Tang

College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
tangyu_mycauc@163.com

Shaoming Luo

College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
smluo@gdut.edu.cn

Guoyuan Li

School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China
phgyli@scut.edu.cn

Zhou Yang

College of Engineering, South China Agricultural University, Guangzhou 510642, China
yangzhou@scau.edu.cn

Chaojun Hou

College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China
hcj_carson@126.com

1Corresponding author.

ASME doi:10.1115/1.4038861 History: Received September 18, 2017; Revised December 26, 2017

Abstract

The ripening growth kinetics of interfacial Cu6Sn5 grains between Cu substrates and Sn-3.0Ag-0.5Cu-xTiO2 (x = 0, 0.02, 0.05, 0.1, 0.3, and 0.6 wt.%) (SAC305-xTiO2) solders were investigated. The results show that the Cu6Sn5 grain morphology is affected by the solder composition and the reflow time. The Cu6Sn5 grain size decreases upon addition of TiO2 and shows a significant decrease when the TiO2 nanoparticle fraction is increased to 0.1 wt.%. At higher TiO2 nanoparticle fractions, the Cu6Sn5 grain size increases slightly. The growth of the Cu6Sn5 grains is mainly supplied by the flux of the interfacial reaction and the flux of ripening; the ripening flux plays a dominant role because it is approximately one order of magnitude greater than the interfacial reaction flux. The ripening growth of the Cu6Sn5 grains in the TiO2-containing solder joints is reduced more effectively than that of the Cu6Sn5 grains in the TiO2-free joint. For the SAC305/Cu and SAC305-0.6TiO2/Cu solder joints, the particle size distribution (PSD) of the Cu6Sn5 grains is well fit with the Marqusee and Ross (MR) model when the r/<r> is less than 1, and it is consistent with the flux-driven ripening (FDR) model when the r/<r> is greater than 1. For the SAC305-0.1TiO2/Cu solder joint, the Cu6Sn5 grains with a nearly hemispheric scallop shape and the PSD of the Cu6Sn5 grains show good agreement with the FDR model.

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