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research-article

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

[+] Author and Article Information
Yasuo Takahashi

Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, 567-0047, Japan
takasy@jwri.osaka-u.ac.jp

Hiroki Fukuda

Graduate Students, Osaka University, Yamada-oka, Suita, Osaka, 565-0871, Japan
hifukud@casi.osaka-u.ac.jp

Yasuhiro Yoneshima

Graduate Students, Osaka University, Yamada-oka, Suita, Osaka, 565-0871, Japan
yayones@casi.osaka-u.ac.jp

Hideki Kitamura

Graduate Students, Osaka University, Yamada-oka, Suita, Osaka, 565-0871, Japan
hikitam@casi.osaka-u.ac.jp

Masakatsu Maeda

Nihon University, 1-2-1 Narashino, Chiba, 275-8575, Japan
maeda.masakatsu@nihon-u.ac.jp

1Corresponding author.

ASME doi:10.1115/1.4038143 History: Received March 09, 2017; Revised September 21, 2017

Abstract

Low-temperature microjoining such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB) is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding, and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of wire bonding and FCB are discussed based on experimental results.

Copyright (c) 2017 by ASME
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