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research-article

Determination of Energy Release Rate through Sequential Crack Extension

[+] Author and Article Information
Scott McCann

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA 30332
mccann.scott.r@gmail.com

Gregory Ostrowicki

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA 30332
gtostrowicki@ti.com

Anh Tran

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA 30332
anh.vt2@gatech.edu

Timothy Huang

3D Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA 30332
tim.huang@gatech.edu

Tobias Bernhard

Atotech Deutschland GmbH, 10553 Berlin, Germany Affiliation
tobias.bernhard@atotech.com

Rao Tummala

3D Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA 30332
rtummala@ece.gatech.edu

Suresh Sitaraman

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA 30332
suresh.sitaraman@me.gatech.edu

1Corresponding author.

ASME doi:10.1115/1.4037334 History: Received March 22, 2017; Revised June 04, 2017

Abstract

A method to determine the critical energy release rate of a peel tested sample using an energy based approach within a finite-element framework is developed. The method uses a single finite-element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10 ┬Ám thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m2.

Copyright (c) 2017 by ASME
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